ARIES ELECTRONICS / LARSEN ASSOCIATES
Adaptor Sockets ,Correct-A-Chip© Adapters, Horizontal and Vertical Display Sockets, Test Sockets, Burn-in sockets, Chip Scale Test Sockets, burn-in SMT Device Low frequency High Frequency CSP BGA, LGA, RF, ZIF, QFN, SOIC, TSSOP, DFN, PQFP, MLF, µBGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSOP, SOP, LCC, PLCC, TO, RF, ZIF Any Surface Mount smt Package Style with leads or without Leads PGA packaged devices. Standard & Custom Microprocessor BGA sockets Ball Grid Array Land grid array CSP Test Sockets .5 .4 .35 .2 .3 mm pitch any SMT device
Test Sockets, Burn-In Sockets, IC Adaptors, High Temperature Sockets, Chip Adapters, Display Sockets, Standard & Custom Packaging Solutions
Aries Test & Burn-In Sockets Gallery - Navigation Page: Click on the Gallery number below to view.
Gallery 2
6.5mm
23021 style
Gallery 3
13mm
23017 style
Gallery 4
27 mm
23018 style
"Aries, the world leader in Spring Probe Test & Burn-In Socket Technology"
MORE INFO & Data Sheets: Chip Scale Test & Burn-In Sockets Test & Burn-In of Any SMT Device! CSP BGA LGA QFN DSP SRAM DRAM Flash Devices, etc.
The Aries Electronics Gallery of Test and Burn-In Socket Images, Click on the Gallery name to view.
Once at the Gallery, roll over the thumbnails to view the large close up images. More Galleries to come.
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© 1988 - © 2014 Copyright Larsen Associates
6/12/14