Aries Electronics / Larsen Associates


Aries Logo IC Test sockets Burn-in socktetsTest Sockets, Burn-In Sockets, IC Adaptors, Display Sockets, plus Standard & Custom Packaging Solutions


Test & Burn-in Sockets / IC Adapters "Correct-A-Chip™"/ High Temperature Sockets / Display Sockets / Contact US


- For Test Socket and / or Burn-in Socket applications.
- Low or High Frequency

- For Test: 1GHz up to 18.5 GHz
- For Burn-in: -55C to +150C
.
- Guaranteed perfect fit and contact.
- Any Pitch
- Any Footprint configuration

- For Any SMT Device & Any footprint!
- Any pitch from 0.2mm and up
- Any configuration
- No tooling charge, small set-up
- No extra extra lead-time
- Performance and perfect fit Guranteed
- Higher performance with Lower cost

"Aries, the world leader in Spring Probe Test Socket and / or Burn-In Socket Technology"


- Email your device drawing & quantity needed to us, and we can send you price and delivery info quickly. Contact Us Today

CSP BGA, LGA, RF, ZIF, QFN, SOIC, TSSOP, DFN, PQFP, MLF, µBGA, MicroBGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSOP, SOP, LCC, PLCC, TO, RF, ZIF and Any Surface Mount smt Package Style with leads or without Leads plus most PGA packaged devices. Standard & Custom. Any SMT Device! <1Ghz to 18.5GhZ. 0.2 mm pitch & up, 20, 15, or 10 Day Delivery Available.

Click here to See More Options and more info: Aries Gallery of Test & Burn-in Socket Images


Aries Electronics makes a family of 5 test sockets or burn-in sockets with standard molded bodies that accommodate all device sizes from less than 1 mm up to 55 mm square, and any surface mount configuration. Spring Probe Sockets for Test Socket and / or Burn-in Socket applications.

The socket bodies are molded, however the internal interposer, and pressure pad are made to order to fit your exact device.

Because the bodies are standard molded parts, and only the internal parts are custom machined, these Aries test sockets or burn-in sockets can save hundreds, or even thousands of dollars, over fully machined custom parts, and still provide the best performance benefits in the industry. (500,000 cycles and from under 1GHz and up to 18.5GHz, self inductance 0.51nH and signal paths as short as 0.077") or for Burn-in -55C to +150C.


The internal interposer is drilled to accept the spring probes to exactly match your device footprint, whatever that is. Any surface mount device, any pitch from 0.2 mm and up, any configuration including mixed pitch and staggered pitch. We can accommodate any pattern..
Aries designs the internal parts of the socket to your drawing of your device, and / or to your actual device.

The drawing on the sockets data sheets shows the layout of the socket less the interior portion that is modified for your device. For your layout, the center datum point is a common dimension for both the IC and socket.
Please review the data sheets and / or let us know if you have questions.

For any SMT device including:
QFP (Quad Flat Package),TSSOP (Thin Shrink Small Outline Package), CSP (Chip Scale Package), BGA (Ball Grid Array), QFN (Quad Flat No-Lead Package), MLF (Micro Lead Frame) and all surface mount devices and more.


Extra Small: Aries IC Test Socket & Burn-in Socket
Test socket, Burn-in socket, CSP, BGA, LGA, QFN,QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP, SOIC, LCC, PLCC, TO, SMT, PGA, Ball grid Array, Land Grid array, Micro, Micro BGA, µBGA, Bump-Array, Test & burn in, Spring Probe, probe, pogo, pin, Aries, Larsen Associates, Chip, Integrated Circuit, IC socketsSmallest IC test socket burn-in socket
For any smt device up to 6.5 mm 23021 or 24013 Style


EXTRA SMALL FOOTPRINT
-For from 1 mm or less packages up to 6.5 mm packages
- .2 mm pitch & up
-Chip Scale to fit any package footprint. For Any SMT device, BGA or any other Contact style. Now .2 mm pitch and up

-"Fast, Economical, Cost Effective, From under 1GHz & available up to 18.5GHz"

1GHZ or less = DATA SHEET # 23021.pdf

Over 1GHZ up to 18.5GHz = DATA SHEET # 24013.pdf

-More Info

-EZ Quote Request


Small: Aries IC Test Socket & Burn-in Socket
Ic Test socket, burn-in socket, BGA LGA QFN any SMT CSP
For any SMT device up to 13 mm, 23017 / 24008 style


SMALL
-For 6.6 mm packages up to 13 mm packages, .2 mm pitch & up
-Chip Scale to fit any package footprint. For Any SMT device, BGA or any other Contact style. Now 0.2 mm pitch and up. More Info

-"Fast, Economical, Cost Effective, From under 1Ghz & available up to 18.5GHz"

1GHZ or less = DATA SHEET# 23017.pdf

Over 1GHZ up to 18.5GHz = DATA SHEET # 24008.pdf

-EZ Quote Request


Medium: Aries IC Test Socket & Burn-in Socket
Semiconductor test and burn-in socket, LGA BGA CSP any SMT QFN TSSOP PLCC

For any SMT device up to 27 mm, 23018 / 24009 style


MEDIUM
-For 14 mm packages up to 27 mm packages, .2 mm pitch & up

-Chip Scale to fit any package footprint. For Any SMT device, BGA or any other Contact style. Now 0.2 mm pitch and up. More info

-"Fast, Economical, Cost Effective, From under 1GHz & available up to 18.5GHz"

1GHZ or less = DATA SHEET# 23018.pdf

Over 1GHZ up to 18.5GHz = DATA SHEET # 24009.pdf

-EZ Quote Request



Large: Aries IC Test Socket & Burn-in Socket
Test socket, Burn-in socket, CSP, BGA, LGA, QFN,QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP, SOIC, LCC, PLCC, TO, SMT, PGA, Ball grid Array, Land Grid array, Micro, Micro BGA, µBGA, Bump-Array, Test & burn in, Spring Probe, probe, pogo, pin, Aries, Larsen Associates, Chip, Integrated Circuit, IC sockets
For any SMT device up to 40 mm. 23019 / 24011 style


LARGE
-For 28 mm to 40 mm packages, .2 mm pitch & up

-Chip Scale to fit any package footprint. For Any SMT device, BGA or any other Contact style, Now 0.2 mm pitch and up. More Info

-"Fast, Economical, Cost Effective, From under 1GHz & available up to 18.5GHz"

1GHZ or less = DATA SHEET# 23019.pdf

Over 1GHZ up to 18.5GHz = DATA SHEET # 24011.pdf

-EZ Quote Request


Extra Large: Aries IC Test Socket & Burn-in Socket
Large IC Test socket burn n socket any surface mount device CSP large array any pitch
For any SMT device up to 55 mm, 23020 / 24012 style


Extra - LARGE
-For 41 mm packages up to 55 mm packages. .2 mm pitch & up
-Chip Scale to fit any package footprint. For Any SMT device, BGA or any other Contact style. Now 0.2 mm pitch and up. More Info

-"Fast, Economical, Cost Effective, From under 1GHz & available up to 18.5GHz"

1GHZ or less = DATA SHEET# 23020.pdf

Over 1GHZ up to 18.5GHz = DATA SHEET # 24012.pdf

-EZ Quote Request


Aries 200C High Temp IC Test Socket & Burn-in Socket
High Temp Temperature IC test socket BGA LGA QFN MLCC Bumped Die
Available for any SMT device, 23026 style.


High-Temp (up to 200°C) CSP Burn-in & Test Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices or Any Custom Machined Configuration – for high-frequency bandwidth, low inductance, and high-current applications in a reliable and durable socket housing

Data Sheet PDF 23026HT


Aries Optical Test socket
Optical test socket FA Test socket lens no lnes custom standard
Available for any SMT device, 23023 style


Optical Test socket
Available with or without filters for UV, infrared and full spectrum applications, Aries’ new optical test socket is ideal for testing an optical sensor type chip and for EMMI testing a standard chip using an infrared head sensor. The optical test socket line can accommodate many different optical window and lens materials, including glass, sapphire, and plastic depending on operational requirements. The standard optical grade window on the 23023 socket uses a high-quality quartz V077 glass with a 98% transmission rate from <260nm in the UV to >2000nm in the infrared.

Data Sheet PDF: 23023


Aries Adjustable "Z" test socket
Z adjustable ic test socket, variable height test socket
Available for any SMT device


The ADJUSTABLE Z Chip Scale Test Socket: Freedom of Range for different device thickness options, or device fragility.
For prototypes of an IC chip under development that will always have the same footprint, but may have the thickness of the package vary until the design is firmed up, or have a requirement to apply minimum force, and no more, such as with fragile ceramic chips or very thin devices.

Other variations can include an optical pathway down the center of the adjuster. We have the capability. Let us build exactly what you need.

The Adjustable IC test Socket from Aries Data sheet


Aries Chip Scale Test Sockets:
IC test socket spring probeSpring Probes, Data Sheets, & Test Reports


Aries Patented Spring Probes
Aries Spring Probes for IC test sockets and burn-in socket
Aries Patented Spring Probes for Test Socket and / or Burn-in Socket applications.


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05/18/2015