| ARIES ELECTRONICS / LARSEN ASSOCIATES |
| Standard and Custom Adaptors, Sockets, Conversion, and Interconnect Packaging Solutions |
| Chip Scale Test & Burn-In Sockets Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM, QFN, Flash Devices, etc. Any SMT Device! |
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"Aries, the world leader in spring probe Test and Burn-In Socket technology"
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Click here for larger image and Data Sheets
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Chip Scale Test & Burn-in Sockets for 1 mm or less to 55 mm packages
"Aries, a world leader in test socket technology"
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Test & Burn-In CSP, MicroBGA, DSP, LGA, SRAM, DRAM, QFN, Flash Devices, etc. Any SMT Device! <1Ghz to 18.5GhZ
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| Click here for more info: 1 mm or less to 6.5 mm packages - Chip Scale Test Sockets ...NEW!...Very Small Footprint!! |
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All Now available with .4mm pitch and up ---- 20, 15, or 10 Day Delivery Available.
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............. NEW! .............
VERY EXTRA SMALL FOOTPRINT
-For from 1 mm or less packages up to 6.5 mm packages
-Chip Scale to fit any package footprint. For Any SMT device, BGA or any other Contact style. Now .4mm pitch and up
-"Fast, Economical, Cost Effective, From under 1GHz & available up to 18.5GHz"
DATA SHEET# 23021.pdf
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Click image for larger view |
SMALL
-For 6.6 mm packages up to 13 mm packages
-Chip Scale to fit any package footprint. For Any SMT device, BGA or any other Contact style. Now .4mm pitch and up. More Info
-"Fast, Economical, Cost Effective, From under 1Ghz & available up to 18.5GHz"
1GHZ or less = DATA SHEET# 23017.pdf
Over 1GHZ up to 18.5GHz = DATA SHEET # 24008.pdf
-EZ Quote Request
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MEDIUM
-For 14 mm packages up to 27 mm packages
-Chip Scale to fit any package footprint. For Any SMT device, BGA or any other Contact style. Now .4mm pitch and up. More info
-"Fast, Economical, Cost Effective, From under 1GHz & available up to 18.5GHz"
1GHZ or less = DATA SHEET# 23018.pdf
Over 1GHZ up to 18.5GHz = DATA SHEET # 24009.pdf
-EZ Quote Request
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Click image for larger view |
LARGE
-For 28 mm to 40 mm packages
-Chip Scale to fit any package footprint. For Any SMT device, BGA or any other Contact style, Now .4mm pitch and up. More Info
-"Fast, Economical, Cost Effective, From under 1GHz & available up to 18.5GHz"
1GHZ or less = DATA SHEET# 23019.pdf
Over 1GHZ up to 18.5GHz = DATA SHEET # 24011.pdf
-EZ Quote Request
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Click image for larger view
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Extra - LARGE
-For 41 mm packages up to 55 mm packages.
-Chip Scale to fit any package footprint. For Any SMT device, BGA or any other Contact style. Now .4mm pitch and up. More Info
-"Fast, Economical, Cost Effective, From under 1GHz & available up to 18.5GHz"
1GHZ or less = DATA SHEET# 23020.pdf
Over 1GHZ up to 18.5GHz = DATA SHEET # 24012.pdf
-EZ Quote Request
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| Back to top of page / Selection Guide / Large Photos of above / "Cool sockets for Hot issues" |
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Your Engineering Library needs this Web Guide!
Find what you need Fast!
References links to all standard Aries products, data sheet numbers, part numbers, photographs and descriptions.
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Aries Web Guide
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Adaptor Sockets (Any Footprint to Any Footprint, Any Pin to Pin, Any Termination, 26 days),Correct-A-Chip© Adapters, Horizontal and Vertical Display Sockets , Elevated Sockets, Test Sockets. IC, ZIF, BGA, SOIC, LGA, PLCC, QFP ,PQFP, DIP, SIP, PGA, TSOP, TO, SWOIC ASIC Sockets, Ejecting,Oscillator, D-Ram, Pin Carrier Sockets. Headers, high performance production LGA asics sockets, pin ball LGA BGA socket Jumpers and More. Aries is located in Frenchtown, N.J., U.S.A. Microprocessor BGA sockets Ball Grid Array Land grid array
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© Copyright 1988-2008 Larsen Associates /
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