ARIES ELECTRONICS / LARSEN ASSOCIATES
Standard and Custom Adaptors, Sockets, Conversion, and Interconnect Packaging Solutions
Chip Scale Test & Burn-In Sockets Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM, QFN, Flash Devices, etc. Any SMT Device!

"Aries, the world leader in spring probe Test and Burn-In Socket technology"

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pitch .4mm & up <1Ghz
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Click here for larger image and Data Sheets

Chip Scale Test & Burn-in Sockets for 1 mm or less to 55 mm packages
"Aries, a world leader in test socket technology"
Test & Burn-In CSP, MicroBGA, DSP, LGA, SRAM, DRAM, QFN, Flash Devices, etc. Any SMT Device! <1Ghz to 18.5GhZ
Click here for more info: 1 mm or less to 6.5 mm packages - Chip Scale Test Sockets ...NEW!...Very Small Footprint!!
Click here for more info: 6.6 mm to 13 mm packages - Chip Scale Test Sockets
Click here for more info: 14 mm to 27 mm packages - Chip Scale Test Sockets
Click here for more info: 28 mm to 40 mm packages - Chip Scale Test Sockets
Click here for more info: 41 mm to 55 mm packages - Chip Scale Test Sockets
All Now available with .4mm pitch and up ---- 20, 15, or 10 Day Delivery Available.
> > > > > New > > > > > > ....................................... Very Small footprint Test & Burn-In Socket for 1 mm or less to 6.5 mm packages............................... 20 working Days Standard Delivery for CSP Test Sockets .................... Also ........................ 10 Day & 15 Day Expedited Delivery ........................All Now Available ...................... Point .4 MM Pitch and up .....................................................................................................................Contact Us Today! ............................................................................................................................................................................................>>>>



Click image for larger view
............. NEW! .............

VERY EXTRA SMALL FOOTPRINT
-For from 1 mm or less packages up to 6.5 mm packages

-Chip Scale to fit any package footprint. For Any SMT device, BGA or any other Contact style. Now .4mm pitch and up

-"Fast, Economical, Cost Effective, From under 1GHz & available up to 18.5GHz"

DATA SHEET# 23021.pdf



Click image for larger view
SMALL
-For 6.6 mm packages up to 13 mm packages

-Chip Scale to fit any package footprint. For Any SMT device, BGA or any other Contact style. Now .4mm pitch and up. More Info

-"Fast, Economical, Cost Effective, From under 1Ghz & available up to 18.5GHz"

1GHZ or less = DATA SHEET# 23017.pdf

Over 1GHZ up to 18.5GHz = DATA SHEET # 24008.pdf

-EZ Quote Request



Click image for larger view

MEDIUM
-For 14 mm packages up to 27 mm packages

-Chip Scale to fit any package footprint. For Any SMT device, BGA or any other Contact style. Now .4mm pitch and up. More info

-"Fast, Economical, Cost Effective, From under 1GHz & available up to 18.5GHz"

1GHZ or less = DATA SHEET# 23018.pdf

Over 1GHZ up to 18.5GHz = DATA SHEET # 24009.pdf

-EZ Quote Request



Click image for larger view

LARGE
-For 28 mm to 40 mm packages

-Chip Scale to fit any package footprint. For Any SMT device, BGA or any other Contact style, Now .4mm pitch and up. More Info

-"Fast, Economical, Cost Effective, From under 1GHz & available up to 18.5GHz"

1GHZ or less = DATA SHEET# 23019.pdf

Over 1GHZ up to 18.5GHz = DATA SHEET # 24011.pdf

-EZ Quote Request



Click image for larger view

Extra - LARGE
-For 41 mm packages up to 55 mm packages.

-Chip Scale to fit any package footprint. For Any SMT device, BGA or any other Contact style. Now .4mm pitch and up. More Info

-"Fast, Economical, Cost Effective, From under 1GHz & available up to 18.5GHz"

1GHZ or less = DATA SHEET# 23020.pdf

Over 1GHZ up to 18.5GHz = DATA SHEET # 24012.pdf

-EZ Quote Request


For More Test Sockets over 1 GHz, Click Here

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References links to all standard Aries products, data sheet numbers, part numbers, photographs and descriptions.

Aries Web Guide

Adaptor Sockets (Any Footprint to Any Footprint, Any Pin to Pin, Any Termination, 26 days),Correct-A-Chip© Adapters, Horizontal and Vertical Display Sockets , Elevated Sockets, Test Sockets. IC, ZIF, BGA, SOIC, LGA, PLCC, QFP ,PQFP, DIP, SIP, PGA, TSOP, TO, SWOIC ASIC Sockets, Ejecting,Oscillator, D-Ram, Pin Carrier Sockets. Headers, high performance production LGA asics sockets, pin ball LGA BGA socket Jumpers and More. Aries is located in Frenchtown, N.J., U.S.A. Microprocessor BGA sockets Ball Grid Array Land grid array
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