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"Aries, the world leader in Spring Probe Test & Burn-In Socket Technology" |
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Aries Products
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ADAPTERS
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| Don't Spin, Adapt Instead! ADAPTERS "Correct-A-Chip™" -Standard -Custom -BGA Fan Out Pitch |
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Adapter Checklist Revs
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TEST + Burn-In Sockets
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| -Gallery of Test Sockets |
| -Selection Guide |
| -CSP BGA Test Sockets |
| -CSP LGA Test Sockets |
| Adjustable z-axis sockets |
| RF Test Sockets |
| KELVIN Test Sockets |
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More Test & Burn-in
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| - ZIF Test Sockets, |
| - ZIF Programing - Test / Burn In Sockets |
| - High Temperature - Burn in Sockets |
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BGA LGA Sockets
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| BGA-LGA-CSP - Selection Guide |
| - Pin Ball BGA LGA |
| - Ball Grid Array BGA |
| - LGA Production Volume |
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DISPLAY Sockets
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| Display Sockets, - Vertical - Horizontal |
| Elevated Sockets |
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More
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| All Products |
| Cable Jumper Assemblies |
| Dip / Sip Sockets & Headers |
| Other Socket Packages |
| Programing Devices |
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Aries Information
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| - What's New! |
| Aries Catalog Download |
| Catalog Request |
| Adapter Quote |
| CSP Test Socket Quote |
| RF Sockets Quote |
| Data Sheets |
| Aries Request - Quotes - Samples - Custom Products |
| Other Information |
| Links to Semiconductor Manufacturers |
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.3 mm pitch & up, Chip Scale Test & Burn-in Sockets for 1 mm or less to 55 mm packages
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Test & Burn-In CSP, MicroBGA, DSP, LGA, SRAM, DRAM, QFN, Flash Devices, etc. Any SMT Device! <1Ghz to 18.5GhZ
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| More info: 1 mm or less to 6.5 mm packages - Chip Scale Test Sockets ...NEW!...Very Small Footprint!! | |
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More info: 6.6 mm to 13 mm packages - Chip Scale Test Sockets
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More info: 14 mm to 27 mm packages - Chip Scale Test Sockets
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More info: 28 mm to 40 mm packages - Chip Scale Test Sockets
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More info: 41 mm to 55 mm packages - Chip Scale Test Sockets
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| More info: The Adjustable z-axis IC test Socket from Aries - Chip Scale Test Sockets | |
| Click here to See More Options and more info:Aries Gallery of Test & Burn-in Socket Images | |
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All Now available with .3 mm pitch & up ---- 20, 15, or 10 Day Delivery Available.
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| Aries Electronics makes a family of 5 sockets with standard molded bodies that accommodate all device sizes from less than 1 mm up to 55 mm square, and any surface mount configuration. The socket bodies are molded, however the internal interposer, and pressure pad are made to order to fit your exact device. Because the bodies are standard molded parts, and only the internal parts are custom machined, these Aries sockets can save hundreds, or even thousands of dollars, over fully machined custom parts, and still provide the best performance benefits in the industry. (500,000 cycles and from under 1GHz and up to 18.5GHz, self inductance 0.51nH and signal paths as short as 0.077") The internal interposer is drilled to accept the spring probes to exactly match your device footprint, whatever that is. Any surface mount device, any pitch from 0.3 mm and up, any configuration including mixed pitch and staggered pitch. We can accommodate any pattern.. We design the internal parts of the socket to your drawing of your device, and / or to your actual device. The drawing on the sockets data sheets shows the layout of the socket less the interior portion that is modified for your device. For your layout, the center datum point is a common dimension for both the IC and socket. Please review the data sheets and / or let us know if you have questions. Email your device drawing & quantity needed, and we can send you price and delivery info quickly. Contact Us Today |
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............. NEW! .............VERY EXTRA SMALL FOOTPRINT -For from 1 mm or less packages up to 6.5 mm packages
- .3 mm pitch & up
-Chip Scale to fit any package footprint. For Any SMT device, BGA or any other Contact style. Now .4mm pitch and up -"Fast, Economical, Cost Effective, From under 1GHz & available up to 18.5GHz" 1GHZ or less = DATA SHEET # 23021.pdf |
 For any smt device up to 6.5 mm 23021 or 24013 Style |
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SMALL
-For 6.6 mm packages up to 13 mm packages, .3 mm pitch & up |
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MEDIUM -Chip Scale to fit any package footprint. For Any SMT device, BGA or any other Contact style. Now .4mm pitch and up. More info -"Fast, Economical, Cost Effective, From under 1GHz & available up to 18.5GHz" 1GHZ or less = DATA SHEET# 23018.pdf Over 1GHZ up to 18.5GHz = DATA SHEET # 24009.pdf |
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LARGE -Chip Scale to fit any package footprint. For Any SMT device, BGA or any other Contact style, Now .4mm pitch and up. More Info -"Fast, Economical, Cost Effective, From under 1GHz & available up to 18.5GHz" 1GHZ or less = DATA SHEET# 23019.pdf Over 1GHZ up to 18.5GHz = DATA SHEET # 24011.pdf |
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Extra - LARGE
-For 41 mm packages up to 55 mm packages. .3 mm pitch & up -Chip Scale to fit any package footprint. For Any SMT device, BGA or any other Contact style. Now .4mm pitch and up. More Info -"Fast, Economical, Cost Effective, From under 1GHz & available up to 18.5GHz" 1GHZ or less = DATA SHEET# 23020.pdf Over 1GHZ up to 18.5GHz = DATA SHEET # 24012.pdf |
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The ADJUSTABLE Chip Scale Test Socket: Freedom of Range for different device thickness options, or device fragility.
For prototypes of an IC chip under development that will always have the same footprint, but may have the thickness of the package vary until the design is firmed up, or have a requirement to apply minimum force, and no more, such as with fragile ceramic chips or very thin devices. Other variations can include an optical pathway down the center of the adjuster. We have the capability. Let us build exactly what you need. |
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| Aries Chip Scale Test Sockets: Spring Probes, Data Sheets, & Test Reports | |
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"Aries, a world leader in test socket technology"
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| Back to top of page / Selection Guide / Large Photos of above / "Cool sockets for Hot issues" | |
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Your Engineering Library needs this Web Guide!
Find what you need Fast! References links to all standard Aries products, data sheet numbers, part numbers, photographs and descriptions. |
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Aries Web Guide
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Adaptor Sockets (Any Footprint to Any Footprint, Any Pin to Pin, Any Termination, 26 days),Correct-A-Chip© Adapters, Horizontal and Vertical Display Sockets , Elevated Sockets, Test Sockets. IC, ZIF, BGA, SOIC, LGA, PLCC, QFP ,PQFP, DIP, SIP, PGA, TSOP, TO, SWOIC ASIC Sockets, Ejecting,Oscillator, D-Ram, Pin Carrier Sockets. Headers, high performance production LGA asics sockets, pin ball LGA BGA socket Jumpers and More. Aries is located in Frenchtown, N.J., U.S.A. Microprocessor BGA sockets Ball Grid Array Land grid array
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Catalogs | Phone 650 358-9559 | |
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Data Sheets |
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© Copyright 1988-2010 Larsen Associates /
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