Chip Scale Test & Burn-In Sockets Test & Burn-In of Any SMT Device! CSP BGA LGA QFN DSP SRAM DRAM Flash Devices, etc.
"Aries, the world leader in Spring Probe Test & Burn-In Socket Technology"
- 23018 Style, CSP Sockets with molded bodies with custom machined interiors for any surface mount device, any SMT footprint, with Spring probes any pitch .3 mm and up.
- The 23018 style is for devices from less up to 27 mm
- Device guides, pressure pad, and interposer are machined for your exact device footprint.
- Bottom View showing bottom of spring probes which make electrical contact by compression, no soldering required.
-Sockets shown mounted on clear acrylic plastic simulating a pcb.
- Interior view of interposer with Crown Tip spring probes for ball devices. Pointed tips are used for LGA contacts, and dual tips for Kelvin applications.
- Size comparison between 23018 test and burn-in style socket and the smaller footprint 23017 style test and burn-in socket.
- A 23018 style clamshell with adjustable z-axis micrometer adjustment for delicate or variable z dimension devices.
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Test & Burn-in Sockets

Aries Electronics makes a family of 5 sockets with standard molded bodies that accommodate all device sizes from less than 1 mm up to 55 mm square, and any surface mount configuration. This page shows the 23018 style socket for devices up to 27 mm in size, with pitches as small as 0.2 mm and up. For Any SMT device or footprint including staggered or even mixed pitch. The most advanced test socket on the market. Bodies are molded. The interposer with spring probes, guides, & pressure pad are machined to fit your exact device.
(500,000 cycles and from under 1GHz and up to 18.5GHz, self inductance 0.51nH and signal paths as short as 0.077") Email your device drawing & quantity needed, & we will send price & delivery info quickly. Contact Us Today
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