| ARIES ELECTRONICS / LARSEN ASSOCIATES |
| Chip Scale Test & Burn-In Sockets Test & Burn-In of Any SMT Device! CSP BGA LGA QFN DSP SRAM DRAM Flash Devices, etc. |
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"Aries, the world leader in Spring Probe Test & Burn-In Socket Technology"
Aries makes an unlimited variety of machined RF High Frequency Test sockets to suit your needs, utilizing spring probes, elastomerics, strip and Kapton contacts for manual and automated test plus Kelvin. BGA, LGA, QFN, CSP Any Surface mount smt IC Chip device. |
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RF INTERPOSER
Signal Path Length: as short as 0.011"
Operating Temperature: -55°C to +150°C
Insertions: >50,000
Self-Inductance: 0.09nH
Bandwidth: 40GHz at -1dB
Contact Resistance: <40 milliohms |
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RF MICROSTRIP CONTACT
Signal Path Length: 0.005" and 0.007"
Operating Temperature: -55°C to +150°C
Insertions: 500,000
Self-Inductance: 0.01nH
Bandwidth: 16GHz at -1dB (0.50mm pitch)
Contact Resistance: <70 milliohms |
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Images © 2009 Larsen Associates
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RF CENTER PROBE CONTACT
Signal Path Length: as short as 0.077"
Operating Temperature: -55°C to +150°C
Insertions: >500,000
Self-Inductance: 0.51nH
Bandwidth: 18.0GHz at -1dB (0.5mm pitch)
Contact Resistance: <70 milliohms |
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© 1988 - © 2010 Copyright Larsen Associates
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6/27/10 |
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