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Test & Burn-in Sockets / IC Adapters "Correct-A-Chip™"/ High Temperature Sockets / Display Sockets / Contact US

Selection Guide, and Links to PDF DATA SHEETS
BGA sockets, LGA, CSP Sockets Chip Scale Test and Burn-in Sockets & BGA Adapters

BGA, CSP, LGA Test & Burn-in Sockets, For Any SMT device.
Request a Quote


VERY SMALL FOOTPRINT - Device Size = from less than 1mm up to 6.5mm
CSP BGA LGA test socket burn-in socket
VERY SMALL FOOTPRINT
Very Small Footprint, CSP Micro BGA Socket
For Any SMT device, BGA or any other Contact style

-EZ Quote Request

- CSP Micro BGA Socket
- For Any SMT device, BGA or any other Contact style
- For 1 mm or less packages up to 6.5 mm packages
- Chip Scale to fit any package footprint
-"Fast, Economical, Cost Effective, <1Ghz to 18.5"
Pitch = .2 mm and larger
Device Size = 1mm or less up to 6.5mm
Application = For any SMT device
Test and burn in Socket for CSP,MicroBGA, DSP, LGA, SRAM, DRAM, Flash, etc..
From under 1GHz with versions available to 18.6 GHZ
Hold down = Clam Shell Lid no solder ,
Board mount = Spring contacts with screws to board
Cycles = greater then 500,000 cycles
Contact = springs
Body = UL94V-O /PEEK
Temperature = -55C TO 150C
Insertion Force/ Withdrawal force = 9-12g nominal 15g max

1GHZ or less = DATA SHEET # 23021.pdf

Over 1GHZ up to 18.5GHz = DATA SHEET # 24013.pdf

See Gallery 2


SMALL FOOTPRINT - Device Size = 7mm up to 13mm
IC Test socket Burn-in Socket BGA LGA CSP QFN
SMALL FOOTPRINT
CSP Micro BGA Socket
For Any SMT device, BGA or any other Contact style

-EZ Quote Request

-For 1 mm packages up to 13 mm packages
-Chip Scale to fit any package footprint
-"Fast, Economical, Cost Effective, <1Ghz to 18.5"
Pitch = .2 mm and larger
Device Size = any package up to 13mm
Application = For any SMT device
Test and burn in Socket of CSP,MicroBGA, DSP, LGA, SRAM, DRAM, Flash, etc., From under 1GHz with versions available to 18.6 GHZ
Hold down = Clam Shell Lid no solder ,
Board mount = Spring contacts with screws to board
Cycles = greater then 500,000 cycles
Contact = springs
Body = UL94V-O /PEEK
Temperature = -55C TO 150C
Insertion Force/ Withdrawal force = 9-12g nominal 15g max

1GHZ or less = DATA SHEET# 23017.pdf

Over 1GHZ up to 18.5GHz = DATA SHEET # 24008.pdf

See Gallery 3


MEDIUM FOOTPRINT - Device Size = 14mm up to 27mm
Chip IC Test socket Burn-in sockte LGA BGA CSP
MEDIUM FOOTPRINT
-For 14 mm packages up to 27 mm packages
-Chip Scale to fit any package footprint
-"Fast, Economical, Cost Effective, <1Ghz to 18.5"

-EZ Quote Request

Pitch = .2 mm or larger
Device Size = any package up to 27mm
Application =For any SMT device
Test and burn in Socket of CSP,MicroBGA, DSP, LGA,
SRAM, DRAM and Flash devices, etc., From under 1GHz with versions available to 18.6 GHZ
Hold down = Clam Shell Lid, no solder
Board mount = Spring contacts with screws to board
Contact = 4 point crown to ball, springs to board
Cycles = greater then 500,000 cycles
Body = UL94V-O /PEEK and or Ultem
Temperature = -55C TO 150C
Insertion Force/
Withdrawal force = 9-12g nominal on .5 to.75 mm pitch,17-20g on .8mm up
Data Sheets:
1GHZ or less = DATA SHEET# 23018.pdf

Over 1GHZ up to 18.5GHz = DATA SHEET # 24009.pdf

See Gallery 4


LARGE FOOTPRINT - Device Size = 28mm up to 40mm

CSP BGA LGA Semicunductor IC test socket and burn-in socket
LARGE FOOTPRINT
-CSP Micro BGA Socket
For Any SMT device, BGA or any other Contact style
-For up to 40 mm packages
-Chip Scale to fit any package footprint
-"Fast, Economical, Cost Effective, <1Ghz to 18.5"

-EZ Quote Request

Pitch =.2 mm or larger
Device Size =any package up to 40mm
Application =For any SMT device
Test and burn in Socket of CSP,MicroBGA, DSP, LGA, SRAM, DRAM,and Flash devices, etc.,From under 1GHz with versions available to 18.6 GHZ
Hold down =Clam Shell Lid, no solder
Board mount =Spring contacts with screws to board
Cycles =greater then 500,000 cycles
Body =UL94V-O /PEEK and or Ultem
Contact =4 point crown to ball, springs to board
Temperature =-55C TO 150C
Insertion Force/
Withdrawal force =9-12g nominal on .5 to.75 mm pitch,17-20g on .8mm up
Data Sheets:
1GHZ or less = DATA SHEET# 23019.pdf

Over 1GHZ up to 18.5GHz = DATA SHEET # 24011.pdf

See Gallery 1


EXTRA - LARGE FOOTPRINT - Device Size = 41mm up to 55mm
Chip CSP semiconductor
EXTRA - LARGE FOOTPRINT
For CSP Micro BGA Socket
For Any SMT device, BGA or any other Contact style
-For any package up to 55 mm packages
-Chip Scale to fit any package footprint
-"Fast, Economical, Cost Effective, <1Ghz to 18.5"

-EZ Quote Request

Pitch =.2 mm or larger
Device Size =27mm to 55mm
Application =For any SMT device
Test and burn in Socket of CSP,MicroBGA, DSP, LGA, SRAM, DRAM,and Flash devices, etc., From under 1GHz with versions available to 18.6 GHZ
Hold down =Clam Shell Lid, no solder
Board mount =Spring contacts with screws to board
Cycles =greater then 500,000 cycles
Body =UL94V-O /PEEK and or Ultem
Contact =4 point crown to ball, springs to board
Temperature =-55C TO 150C
Insertion Force/
Withdrawal force =9-12g nominal on .5 to.75 mm pitch,17-20g on .8mm up
Data Sheets:
1GHZ or less = DATA SHEET# 23020.pdf

Over 1GHZ up to 18.5GHz = DATA SHEET # 24012.pdf

See Gallery 1


Aries Spring Probes - Now From 0.2mm pitch and up
Aries Spring Probe pins for test and burn-in sockets
Aries Spring Probes
for above test sockets 0.2 mm pitch & up
Compression spring probes:
heat treated Beryllium Copper Alloy.
Compression Spring Probe plating:
30u" min (0.75um) Gold per Mil-G-4QQ-N-290.
Durability:= 500,000 cycles min.
Contact Force:
= 16g per contact on 0.40 mm pitch,
= 25g per contact on 0.5 -0.75mm pitch
= 25 g per contact on .80mm pitch or larger
Operating Temp:
= -55C (min) to 150C (max);
-67F (min) to 302F (max).
Typical Avg Burn-In Temperature: = 150C max

Aries Chip Scale Test Sockets:
Spring Probes, Data Sheets, & Test Reports


See Gallery 5

CLICK here for More High Frequency RF Test sockets over 1 GHz


Kelvin Sockets
Kelvin Spring Probe Aries test sockets

Kelvin Sockets: FEATURES
- Low resistance testing using dual independent Aries Kelvin spring probe technology per device pad for testing of MLF, QFN, LGA and other leadless devices.
- Any pitch device on 0.40mm pitch or higher
- Socket is easily mounted and removed to & from the test board due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with four stainless steel screws
- The Au over Ni plated compression spring probes leave very small witness marks on the bottom surface of the device pads
- Small overall socket size/profile allows max. number of sockets per test board, while being operator friendly
- Kelvin Test Socket Contact System is available for any Aries CSP and Center Probe Test Sockets
- Pressure pad compression spring provides proper force against device and allows for height variations in device thickness
- Probe blade edge tip for cutting through solder oxide layers
- Signal path during test only 0.082 [2.08]

DATA SHEET # 23022.pdf

See Kelvin Sockets page

-EZ Quote Request


- CSP Hybrid Socket
Open top socket optical inspection access hole screw dwon lid test socket burn-in socket hybrid heat sink
- CSP Hybrid Socket
ZIF style socket using Aries solderless, gold-plated pressure mount Spring Probe

-EZ Quote Request

Pitch = .2mm and larger
Device Size = any size
Socket lid nests device into socket for a reliable connection
Appllication: Suitable for prototyping, test, or burn-in of CSP, BGA, BGA and LGA devices
Specifications:
Body Material: PEEK or TORLON
1dB Bandwidth: 1GHz (0.80mm pitch) (large probe)
Estimated Contact Life: 500,000 cycles
Compression Spring Probes: heat-treated Beryllium-Copper with 30µ min. [0.75µ] Gold per Mil-G-45204 over 30µ min.
[0.75µ] Nickel per SAE-AMS-QQ-N-290
Contact Force :
15g per contact on 0.30-0.35mm pitch
16g per contact on 0.40-0.45mm pitch
25g per contact on 0.50-0.75mm pitch
25g per contact on 0.80mm pitch or larger
Screws and Alignment Pins: Stainless Steel
Inserts: Brass Alloy per QQ-B-626, Tin-plated
Operating Temperature Range: -55ºC to 150ºC [-67º to 302º]
NOTE: Special lid designs and/or materials can be quoted
Socket easily located, mounted & removed from PCB
Signal path during test only 0.077 [1.96]
4-point crown insures “scrub” on solder oxides. Consult factory for other available probe styles
The gold over nickel plated compression spring probes leave very small witness marks on the bottom surface of the device solder balls

See Gallery 6



Adjustable "Z" Height Sockets:Adjustable Z micrometer adjustment height test socket spring probe
Adjustable for Device Thickness Sockets:
For prototypes of a chip under development that will always have the same footprint, but may have the thickness of the package vary until the design is firmed up, or have a requirement to apply minimum force, and no more, such as with fragile ceramic chips or very thin devices.

Aries has developed a way of making the depth of the pressure pad adjustable, using a micrometer. Other variations include and optical pathway down the center of the adjuster. For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM, QFN, PQFP, BGA, Flash Devices, etc..Any Surfance mount device. • Any pitch device on 0.30mm or larger. • Pressure mounting, no soldering required. • 4 Point crown insures scrub” on solder oxides. • Signal path during test only .077” (1.92mm) • Accommodates any package up to 27mm2. • Small overall socket size/profile allows maximum number of sockets per BIB and BIB’s per oven, while being operator friendly.

See Gallery 8

-EZ Quote Request


High Performance Elastomer Test Sockets:
RFIC Microwave Developement socket BGA, LGA, QFN, MLCC, µBGA and Bumped Die Devices
Long-Life Hi-Frequency Sockets for BGA, LGA, QFN, MLCC, µBGA and Bumped Die Devices
Significant improvements to our high-performance contact system. Using our proven Interposer Elastomer Technology, the new CORE feature internally controls compression to ensure stability with extremely low resistance values and much longer contact element life.

Data Sheet # 24005.pdf


High-Temp 200°C CSP Burn-in & Test Sockets:
High Temperature Test socket and HIgh Temp Burn-in sockets 200C
High-Temp (up to 200°C) CSP Burn-in & Test Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices or Any Custom Machined Configuration – for high-frequency bandwidth, low inductance, and high-current applications in a reliable and durable socket housing

Data Sheet # 23026HT.pdf


High-Temp 200°C Universal PGA ZIF Burn-in & Test Sockets:200C High Temperature Temp Universal PGA Test Socket ZIF
High-Temp (up to 200°C) Universal PGA ZIF Burn-in & Test Sockets – for any footprint on standard 8x8 to 21x21 grids

Data Sheet # 10004HT.pdf


High-Temp 250°C RF Test Sockets:


High-Temp (up to 250°C) RF Test Socket with Replaceable Contact Strips – for all peripheral-leaded devices including MLF, QFN, QFP with very low inductance

Data Sheet # 24001HT.pdf


Custom Small or Very Large Array BGA & LGA & CSP Test & BI Sockets:
Custom Large array test sockets BGA LGA CSP
Custom BGA & LGA
Contact us with your needs.

Request a Quote


Optical or Open Top Access sockets: Optical test sockets, open top device access sockets, field of view FOV lens, no lens


FA Sockets:
FA Failure analysis lens quartz test socket


Thermal Test sockets:
Thermal Test sockets, thermal anaysis, top side heat sink, bottom side heat sink, cooling fan, active cooling passive cooling burn-in oven
Top or Bottom Side Heat Sinks & Heat Slug Sockets Test & Burn-in


Custom IC Socket Adapters and / or IC Adapters:
Socket adapters smt to through hole or smt to smt, pin translaton, fan out


Also of Note:
- Aries makes standard IC adapters and Custom IC adaptors to suite your exact needs. Custom Correct-A-Chip™Adaptor Sockets (Any Footprint to Any Footprint, Any Pin to Pin, Any Termination, 20 days), Correct-A-Chip© Adapters

Request a Custom Correct-A-Chip™Adaptor Quote
Or to Request a Quote by email, please include your company name and location, your contact information, description of your application, and your estimated annual quantity.


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06/14/2015