Ball Grid Array, BGA sockets, Land Grid, LGA sockets, BGA,LGA, CSP sockets, adapters, adapter, standard, custom, BGA socket, bgas

VERY SMALL FOOTPRINT
-For 1 mm or less packages up to 6.5 mm packages
-Chip Scale to fit any package footprint
-"Fast, Economical, Cost Effective, <1Ghz to 18.5"
-EZ Quote Request

Pitch = .4 mm and larger
Grid Size = 1mm or less up to 6.5mm
Application = For any SMT device
Test and burn in Socket of CSP,MicroBGA, DSP, LGA, SRAM, DRAM, Flash, etc., From under 1GHz with versions available to 18.6 GHZ
Hold down = Clam Shell Lid no solder ,
Board mount = Spring contacts with screws to board
Cycles = greater then 500,000 cycles
Contact = springs
Body = UL94V-O /PEEK
Temperature = -55C TO 150C
Insertion Force/ Withdrawal force = 9-12g nominal 15g max
Data Sheet: 23021.pdf

CSP Micro BGA Socket
For Any SMT device, BGA or any other Contact style

SMALL
-For 1 mm packages up to 13 mm packages
-Chip Scale to fit any package footprint
-"Fast, Economical, Cost Effective, <1Ghz to 18.5"
-EZ Quote Request

Pitch = .4 mm and larger
Grid Size = 1mm up to 13mm
Application = For any SMT device
Test and burn in Socket of CSP,MicroBGA, DSP, LGA, SRAM, DRAM, Flash, etc., From under 1GHz with versions available to 18.6 GHZ
Hold down = Clam Shell Lid no solder ,
Board mount = Spring contacts with screws to board
Cycles = greater then 500,000 cycles
Contact = springs
Body = UL94V-O /PEEK
Temperature = -55C TO 150C
Insertion Force/ Withdrawal force = 9-12g nominal 15g max
Data Sheet23017.pdf

DATA SHEETCSPmicroBGAtstBurnIn23017.pdf

CSP Micro BGA Socket
For Any SMT device, BGA or any other Contact style

MEDIUM
-For 14 mm packages up to 27 mm packages
-Chip Scale to fit any package footprint
-"Fast, Economical, Cost Effective, <1Ghz to 18.5"
-EZ Quote Request

Pitch = .4 mm or larger
Grid Size = any package up to 27 mm x 27mm
Application =For any SMT device
Test and burn in Socket of CSP,MicroBGA, DSP, LGA,
SRAM, DRAM and Flash devices, etc., From under 1GHz with versions available to 18.6 GHZ
Hold down = Clam Shell Lid, no solder
Board mount = Spring contacts with screws to board
Contact = 4 point crown to ball, springs to board
Cycles = greater then 500,000 cycles
Body = UL94V-O /PEEK and or Ultem
Temperature = -55C TO 150C
Insertion Force/
Withdrawal force = 9-12g nominal on .5 to.75 mm pitch,17-20g on .8mm up
Data Sheet = 23018.pdf
DATA SHEET CSPmicroBGA14to27m23018.pdf

New! CSP Micro BGA Socket
For Any SMT device, BGA or any other Contact style

LARGE
-For up to 40 mm packages
-Chip Scale to fit any package footprint
-"Fast, Economical, Cost Effective, <1Ghz to 18.5"
-EZ Quote Request

Pitch =.4 mm or larger
Grid Size =up to 40mm
Application =For any SMT device
Test and burn in Socket of CSP,MicroBGA, DSP, LGA, SRAM, DRAM,and Flash devices, etc.,From under 1GHz with versions available to 18.6 GHZ
Hold down =Clam Shell Lid, no solder
Board mount =Spring contacts with screws to board
Cycles =greater then 500,000 cycles
Body =UL94V-O /PEEK and or Ultem
Contact =4 point crown to ball, springs to board
Temperature =-55C TO 150C
Insertion Force/
Withdrawal force =9-12g nominal on .5 to.75 mm pitch,17-20g on .8mm up
Data Sheet =23019.pdf

CSP Micro BGA Socket
For Any SMT device, BGA or any other Contact style

Extra - LARGE
-For 28 mm packages up to 55 mm packages
-Chip Scale to fit any package footprint
-"Fast, Economical, Cost Effective, <1Ghz to 18.5"
-EZ Quote Request

Pitch =.4 mm or larger
Grid Size =27mm to 55mm
Application =For any SMT device
Test and burn in Socket of CSP,MicroBGA, DSP, LGA, SRAM, DRAM,and Flash devices, etc., From under 1GHz with versions available to 18.6 GHZ
Hold down =Clam Shell Lid, no solder
Board mount =Spring contacts with screws to board
Cycles =greater then 500,000 cycles
Body =UL94V-O /PEEK and or Ultem
Contact =4 point crown to ball, springs to board
Temperature =-55C TO 150C
Insertion Force/
Withdrawal force =9-12g nominal on .5 to.75 mm pitch,17-20g on .8mm up
Data Sheet = 23020.pdf

=> Aries Spring Probes =>
for above test sockets

Compression spring probes:
heat treated Beryllium Copper Alloy.
Compression Spring Probe plating:
30u" min (0.75um) Gold per Mil-G-4QQ-N-290.
Durability:= 500,000 cycles min.
Contact Force:
= 16g per contact on 0.40 mm pitch,
= 25g per contact on 0.5 -0.75mm pitch
= 25 g per contact on .80mm pitch or larger
Operating Temp:
= -55C (min) to 150C (max);
-67F (min) to 302F (max).
Typical Avg Burn-In Temperature: = 150C max

New! Pin Ball BGA

NOTE: Especially good for when you need to solder down a BGA and there are tight space considerations
-EZ Quote Request

Small to Large, Aries has your needs covered. Scroll down to
See 1400 + contact PinBall socket.

Pitch =1.00mm 1.27mm
Grid Size =any
Application = For any SMT device
Side by side stackable for soldered down BGA electrical connection Socket where "X" dimensions are tight
great for heavily populated board
Hold down = Screw down metal lid, or Al heatsink, no solder
Board mount = BGA SMT
Contact = Spring probe
Body = Glass filled Ultem
Temperature = -55C to 125C
Spring Force = 17 grams @.025
Solderballs = 63-37
Data Sheet = 23022.pdf
ARIES REVOLUTIONARY, COST-EFFECTIVE SIDE-STACKABLE BGA SOCKET
-The first side-stackable BGA socket available on the market.
-The Pin-Ball Socket, can be soldered side-by-side, directly to the existing footprint of a PC board, dramatically improving packaging density.
-The surface mount BGA and LGA socket provides 2 mm of clearance for end components, used for 1.00 mm and 1.27 mm pitch packages up to 50 mm in any footprint and on any size board.
-The Pin-Ball Socket incorporates Aries’ reliable spring probe technology, with a spring force of 17 grams at .025" deflection.
-The new socket employs an Ultem insulator with stainless steel hardware.
-The spring is BeCu alloy and the pins are gold-plated brass alloy.
Users have the choice of a metal cover or customized aluminum heatsink.
-The socket is available in 2-bolt (15mm package or smaller) or 4-bolt (16—50mm package) hold-down styles, depending upon the device size required.
-Pricing for the Pin-Ball Socket starts at $1.00 per ball in quantities of 5 sockets.
Delivery is 2 weeks ARO. Data Sheet PinBall23022BGALGArevE.pdf

BGA to PGA Adapter

Pitch = 1.27mm 1.50mm
Grid Size = any
Application = Adapts SMT BGA footprint to PGA through hole Adapter
Hold down = Solder BGA to adapter
Board mount = Through Hole
Contact = solder pad
Body = UL94V-O/FR4
Data Sheet = 23007.pdf
DATA SHEET BGA/PGAadapter23007.pdf

Socket for the BGA to PGA adapter

Pitch = 1.27mm 1.50mm
Grid Size = any
Application = Socket accepts BGA that is adapted to PGA. For BGA Insertion and removal
Hold down = Solder
Board mount = Through Hole
Contact = 3 finger collet
Body = UL94V-O FR4
Temperature = 105C tin / 125Cgold
Insertion Force/
Withdrawal force = 45 grams/pin 22 grams/pin
Data Sheet = 23008.pdf
DATA SHEETBGAadapterSocket23008.pdf

CSP Ballnest Hybrid Socket

Pitch = .5mm and larger
Grid Size = any size, best for 27mm up to 55mm
Application = Socket for prototyping, test or burn-in of CSP, BGA microBGA and LGA
Hold down = Screw down lid, no solder
Board mount = Spring contacts with screws to board
NOTE: for 27 mm or smaller see CSP Micro BGA Socket
Cycles = 10,000 cycles max
Insertion Force/
Withdrawal force = 15 grams/contact avg
Temperature = -55C to 150C
Body = PEEK
Contact = springs
Data Sheet = 23016.pdf

DATA SHEETCSP/BGA23016.pdf

LGA / BGA Socket

Pitch = 1.00mm, 1.27mm, 1.50mm
Grid Size = any
Application = LGA / BGA Socket for high performance ASICS
Hold down = Lid or custom heat sink, no solder
Board mount = pressure mount contacts with screws to board
Cycles = 100 cycles
Contact = compression
Body = High Temp LCP
Insertion Force/
Withdrawal force = 15 to 25 grams per contact
Data Sheet = 23021.pdf

DATA SHEETnewLGA/BGA23021.pdf

BGA Circuit Bridge Adapter

Pitch = 1.00 mm
Grid Size = any
Application = Adapter for Upgrading and or Testing BGAs
without changing PCB layouts
Board mount = Adapter solders to board
Hold down = BGA solders to adapter
Solderballs = 10/90 tin/lead
Contact = pad
Body = FR4
Data Sheet = 18082.pdf

DATA SHEET18082CircuitBridge.pdf

Custom BGA & LGA

(Large PinBall™ Socket shown™)

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Also of Note: Aries makes standard adapters and Custom adaptors to suite your exact needs.
Custom Correct-A-Chip™Adaptor Sockets (Any Footprint to Any Footprint, Any Pin to Pin, Any Termination, 26 days), Correct-A-Chip© Adapters

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3/20/08