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Aries Logo IC Test sockets Burn-in socktetsTest Sockets, Burn-In Sockets, IC Adaptors, Display Sockets, plus Standard & Custom Packaging Solutions


Test & Burn-in Sockets / IC Adapters "Correct-A-Chip™"/ High Temperature Sockets / Display Sockets / Contact US

- High Frequency High Speed RF Test Sockets
- Up to 40GHz
- RF High Performace, High frequency Test Sockets,
- Standard or Custom Aries Electronics High Frequency High Performance Speed RF Test Sockets For Any Surface Mount device including CSP microBGA SSOP SOT SOP BGA LGA MLF QFN QFP high bandwidth high speed

- For any SMT Device! -.2 mm pitch & up- - Low or High Frequency,-Standard & Custom




Aries High Frequency Test sockets. RF test sockets for CSP BGA, LGA, RF, ZIF, QFN, SOIC, TSSOP, DFN, PQFP, MLF, µBGA, Micro BGA, DSP, LGA, SRAM, DRAM, Bump-Array, QFN, QFP, MLF, DFN, SSOP, Flash Devices, TSOP, SOP, LCC, PLCC, TO, RF, ZIF and Any Surface Mount smt Package Style with leads or without Leads plus most PGA packaged devices.

To Receive a Quote, or Request Information or To Contact, use the "Quick Quote / Info Request Forms" OR Email POD with dimensions, frequecny required, quantity of sockets needed, plus anthing special, and include your fll contact info.


RF High Frequency Aries test socket Aries spring probe pins not pogo pins test burn-in sockets

High-Frequency Center Probe
Test Socket for Devices up to 6.5mm Square
0.2 mm pitch and up

Data Sheet: 24013

CENTER PROBE SOCKETS


high frequency test socket QFN BGA LGA CSP SMT RF Aries Larsen associates 13 mmAries spring probe pins not pogo pins test burn-in sockets

High-Frequency Center Probe™
Test Socket for Devices up to 13mm Square
For test & dynamic burn-in of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash devices on any pitch of 0.30mm pitch or higher. This socket is easily mounted and removed to & from the PCB due to solderless pressure-mount compression spring probes.0.2 mm pitch and up

Data Sheet: 24008

CENTER PROBE SOCKETS


high frequency test socket QFN BGA LGA CSP SMT RF Aries Larsen associates 27mmAries spring probe pins not pogo pins test burn-in sockets
High-Frequency Center Probe™
Test Socket for Devices from 14 to 27mm Square
Our answer for a reliable Area Array Package socket. Our unique style of probes will work for any application. Available pitches down to 0.5mm with Frequency Response over 10GHz!
0.2 mm pitch and up

Data Sheet: 24009

CENTER PROBE SOCKETS


high frequency test socket QFN BGA LGA CSP SMT RF Aries Larsen associates machinedhigh frequency test socket QFN BGA LGA CSP SMT RF Aries Larsen associates machinedAries spring probe pins not pogo pins test burn-in sockets
Machined High-Frequency Center Probe
Test Socket for BGA, CSP & MLF Packages, any size package.
Our answer for a reliable Area Array Package socket. Our unique style of probes will work for any application. Available pitches down to 0.5mm with Frequency Response over 10GHz! 0.2 mm pitch and up

Data Sheet: 24010

Machined Center Probe Sockets

 


high frequency test socket QFN BGA LGA CSP SMT RF Aries Larsen associatesAries spring probe pins not pogo pins test burn-in sockets
High-Frequency Center Probe™
Test Socket for Devices up to 40mm Square
For high-frequency Testing & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices on any pitch device on 0.2 mm or larger. The 4-point Crown insures “scrub” on solder oxides.

Data Sheet: 24011

CENTER PROBE SOCKETS


high frequency test socket QFN BGA LGA CSP SMT RF Aries Larsen associatesAries spring probe pins not pogo pins test burn-in sockets
High-Frequency Center Probe™
Test Socket for Devices up to 55mm Square
For high-frequency testing of CSP, BGA, DSP, LGA, SRAM, DRAM, and Flash devices on any pitch of 0.2 mm or larger. The four-point crown insures “scrubbing” of solder oxides, while pointed probe works with LGA’s, MLF’s, etc.

Data Sheet: 24012

CENTER PROBE SOCKETS


Kelvin test socket high frequency test socket QFN BGA LGA CSP SMT RF Aries Larsen associatesKelvin contact spring probe pin not pogo pin

Kelvin Test Sockets

Data Sheet: 23022

CENTER PROBE SOCKETS


Elastomer contact extremely low contact resistance long lifehigh-performance contact system. Using our proven Interposer Elastomer Technology test socket burn-in

Long-Life Hi-Frequency
Sockets for BGA, LGA, QFN, MLCC, µBGA and Bumped Die Devices

Data Sheet: 24005

Significant improvements to our high-performance contact system. Using our proven Interposer Elastomer Technology, the new CORE feature internally controls compression to ensure stability with extremely low resistance values and much longer contact element life.


 contacts which lie flat on the DUT board and become part of the transmission line low as 0.01nH and Frequency Response to 19GHz

RF Test Sockets w/Replaceable Contact Strips
These sockets use our patented Microstrip™ contacts which lie flat on the DUT board and become part of the transmission line. Self-inductance as low as 0.01nH and Frequency Response to 19GHz.

Data Sheet: 24001

MICROSTRIP SOCKETS
Quick Quote / Info Request


Hi Frequency RF Kapton interposer socket Aries Larsen AssociatesKapton Interposer socket gives you the High-frequency characteristicsHigh-Frequency Interposer Socket
Now you can get the best of both worlds! The Kapton Interposer socket gives you the High-frequency characteristics of our Microstrip™ Contact Socket combined with the close component placement of our Spring Probe Sockets. Signal paths can be as short as 0.008" [0.203mm] while the pad layouts can be identical to the package footprint.

Data Sheet: 24007

HIGH FREQUENCY
INTERPOSER SOCKET
Quick Quote / Info Request


termal test socket high frequency test socket QFN BGA LGA CSP SMT RF Aries Larsen associatesThermal cooler test socekt Aries Larsen AssociatesThermoelectric-cooled RF Test Socket
Peltier Technology is incorporated into test socket lid assembly. The thermoelectric cooler (TEC) provides fast and accurate temperature control, while the built-in epoxy-encapsulated thermistor maintains a highly-accurate temperature sensing of ±0.02°C.

Data Sheet: 24002

Thermoelectric-cooled SOCKETS
Quick Quote / Info Request


Thermal test socket Thermal burn in socket Aries Larsen Associates

Got a "BIG" Thermal issue ;-)?
Or small issue?

Thermal Heat Sink sockets top side and bottonm side heatsinks, fans, cooling towers. heat slugs, etc.. Aries can generate Thermal Analysis reports for you.


Gallery & Information for Test and Burn-in Sockets (navigation)

Test & Burn-in Sockets

Click here for Aries Chip Scale Test Sockets:
Spring Probes, Data Sheets, & Test Reports


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