High Frequency High Speed RF Test Sockets
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RF High Performace, High frequency Test Sockets, Standard or Custom |
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Aries Products
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ADAPTERS
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| Don't Spin, Adapt Instead! ADAPTERS "Correct-A-Chip™" -Standard -Custom -BGA Fan Out Pitch |
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Adapter Checklist Revs
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TEST + Burn-In Sockets
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| -Gallery of Test Sockets |
| -Selection Guide |
| -CSP BGA Test Sockets |
| -CSP LGA Test Sockets |
| Adjustable z-axis sockets |
| RF Test Sockets |
| KELVIN Test Sockets |
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More Test & Burn-in
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| - ZIF Test Sockets, |
| - ZIF Programing - Test / Burn In Sockets |
| - High Temperature - Burn in Sockets |
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BGA LGA Sockets
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| BGA-LGA-CSP - Selection Guide |
| - Pin Ball BGA LGA |
| - Ball Grid Array BGA |
| - LGA Production Volume |
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DISPLAY Sockets
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| Display Sockets, - Vertical - Horizontal |
| Elevated Sockets |
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More
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| All Products |
| Cable Jumper Assemblies |
| Dip / Sip Sockets & Headers |
| Other Socket Packages |
| Programing Devices |
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Aries Information
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| - What's New! |
| Aries Catalog Download |
| Catalog Request |
| Adapter Quote |
| CSP Test Socket Quote |
| RF Sockets Quote |
| Data Sheets |
| Aries Request - Quotes - Samples - Custom Products |
| Other Information |
| Links to Semiconductor Manufacturers |
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Aries Electronics High Frequency High Speed Performance RF Test Sockets CSP
microBGA SSOP SOT SOP BGA LGA MLF QFN QFP & More high bandwidth high frequency |
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To Receive a Quote, or Request Information or Contact, use the "Quick Quote / Info Request Forms"
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Aries Sockets
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Data Sheet PDF**
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Detail
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High Frequency RF Test Sockets
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RF Test Sockets w/Replaceable Contact Strips
These sockets use our patented Microstrip™ contacts which lie flat on the DUT board and become part of the transmission line. Self-inductance as low as 0.01nH and Frequency Response to 19GHz. MICROSTRIP SOCKETS Quick Quote / Info Request |
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High-Frequency Interposer Socket
Now you can get the best of both worlds! The Kapton Interposer socket gives you the High-frequency characteristics of our Microstrip™ Contact Socket combined with the close component placement of our Spring Probe Sockets. Signal paths can be as short as 0.008" [0.203mm] while the pad layouts can be identical to the package footprint. HIGH FREQUENCY INTERPOSER SOCKET Quick Quote / Info Request |
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High-Frequency Center Probe Test Socket for Devices up to 6.5mm Square
0.3 mm pitch and up CENTER PROBE SOCKETS Quick Quote / Info Request |
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High-Frequency Center Probe™ Test Socket for Devices up to 13mm Square
For test & dynamic burn-in of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash devices on any pitch of 0.30mm pitch or higher. This socket is easily mounted and removed to & from the PCB due to solderless pressure-mount compression spring probes.0.3 mm pitch and up CENTER PROBE SOCKETS Quick Quote / Info Request |
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High-Frequency Center Probe™ Test Socket for Devices from 14 to 27mm Square
Our answer for a reliable Area Array Package socket. Our unique style of probes will work for any application. Available pitches down to 0.5mm with Frequency Response over 10GHz! 0.3 mm pitch and up CENTER PROBE SOCKETS Quick Quote / Info Request |
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Machined High-Frequency Center Probe Test Socket for BGA, CSP & MLF Packages
Our answer for a reliable Area Array Package socket. Our unique style of probes will work for any application. Available pitches down to 0.5mm with Frequency Response over 10GHz! 0.3 mm pitch and up Machined Center Probe Sockets Quick Quote / Info Request |
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High-Frequency Center Probe™ Test Socket for Devices up to 40mm Square
For high-frequency Testing & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices on any pitch device on 0.30mm or larger. The 4-point Crown insures “scrub” on solder oxides. CENTER PROBE SOCKETS Quick Quote / Info Request |
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High-Frequency Center Probe™ Test Socket for Devices up to 55mm Square
For high-frequency testing of CSP, BGA, DSP, LGA, SRAM, DRAM, and Flash devices on any pitch of 0.30mm or larger. The four-point crown insures “scrubbing” of solder oxides, while pointed probe works with LGA’s, MLF’s, etc. CENTER PROBE SOCKETS Quick Quote / Info Request |
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Patent Pending |
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Thermoelectric-cooled RF Test Socket
Peltier Technology is incorporated into test socket lid assembly. The thermoelectric cooler (TEC) provides fast and accurate temperature control, while the built-in epoxy-encapsulated thermistor maintains a highly-accurate temperature sensing of ±0.02°C. Thermoelectric-cooled SOCKETS Quick Quote / Info Request |
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Your Engineering Library needs this Web Guide!
Find what you need Fast! References links to all standard Aries products, data sheet numbers, part numbers, photographs and descriptions. |
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Aries Web Guide
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Copyright © 1988-2009 LARSEN ASSOCIATES
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