ARIES ELECTRONICS / LARSEN ASSOCIATES
High Frequency High Speed RF Test Sockets
Aries Electronics High Frequency High Performance Speed RF Test Sockets CSP microBGA SSOP SOT SOP BGA LGA MLF QFN QFP high bandwidth high speed

RF High Performace, High frequency Test Sockets, Standard or Custom

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Aries Electronics High Frequency High Speed Performance RF Test Sockets CSP
microBGA SSOP SOT SOP BGA LGA MLF QFN QFP & More high bandwidth high frequency

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Detail
High Frequency RF Test Sockets

RF Test Sockets w/Replaceable Contact Strips
These sockets use our patented Microstrip™ contacts which lie flat on the DUT board and become part of the transmission line. Self-inductance as low as 0.01nH and Frequency Response to 19GHz.

MICROSTRIP SOCKETS
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High-Frequency Interposer Socket
Now you can get the best of both worlds! The Kapton Interposer socket gives you the High-frequency characteristics of our Microstrip™ Contact Socket combined with the close component placement of our Spring Probe Sockets. Signal paths can be as short as 0.008" [0.203mm] while the pad layouts can be identical to the package footprint.

HIGH FREQUENCY
INTERPOSER SOCKET
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High-Frequency Center Probe Test Socket for Devices up to 6.5mm Square
0.3 mm pitch and up

CENTER PROBE SOCKETS
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High-Frequency Center Probe™ Test Socket for Devices up to 13mm Square
For test & dynamic burn-in of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash devices on any pitch of 0.30mm pitch or higher. This socket is easily mounted and removed to & from the PCB due to solderless pressure-mount compression spring probes.0.3 mm pitch and up
CENTER PROBE SOCKETS
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High-Frequency Center Probe™ Test Socket for Devices from 14 to 27mm Square
Our answer for a reliable Area Array Package socket. Our unique style of probes will work for any application. Available pitches down to 0.5mm with Frequency Response over 10GHz!
0.3 mm pitch and up

CENTER PROBE SOCKETS
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Machined High-Frequency Center Probe Test Socket for BGA, CSP & MLF Packages
Our answer for a reliable Area Array Package socket. Our unique style of probes will work for any application. Available pitches down to 0.5mm with Frequency Response over 10GHz! 0.3 mm pitch and up
Machined Center Probe Sockets
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High-Frequency Center Probe™ Test Socket for Devices up to 40mm Square
For high-frequency Testing & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices on any pitch device on 0.30mm or larger. The 4-point Crown insures “scrub” on solder oxides.

CENTER PROBE SOCKETS
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High-Frequency Center Probe™ Test Socket for Devices up to 55mm Square
For high-frequency testing of CSP, BGA, DSP, LGA, SRAM, DRAM, and Flash devices on any pitch of 0.30mm or larger. The four-point crown insures “scrubbing” of solder oxides, while pointed probe works with LGA’s, MLF’s, etc.

CENTER PROBE SOCKETS
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Patent Pending
Kelvin Test Socket

CENTER PROBE SOCKETS
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Thermoelectric-cooled RF Test Socket
Peltier Technology is incorporated into test socket lid assembly. The thermoelectric cooler (TEC) provides fast and accurate temperature control, while the built-in epoxy-encapsulated thermistor maintains a highly-accurate temperature sensing of ±0.02°C.

Thermoelectric-cooled SOCKETS
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Image Gallery of Sockets (navigation)

Galeries
1 - 2 - 3 - 4 - 5 - 5A- 6 - 7 - 8 - 9- -10 -11 - 12 -

Test & Burn-in Sockets


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