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Adaptor Sockets ,Correct-A-Chip Adapters, Horizontal and Vertical Display Sockets, Test Sockets, Burn-in sockets, Chip Scale Test Sockets, burn-in SMT Device Low frequency High Frequency CSP BGA, LGA, RF, ZIF, QFN, SOIC, TSSOP, DFN, PQFP, MLF, BGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSOP, SOP, LCC, PLCC, TO, RF, ZIF Any Surface Mount smt Package Style with leads or without Leads PGA packaged devices. Standard & Custom Microprocessor BGA sockets Ball Grid Array Land grid array CSP Test Sockets .5 .4 .35 .2 .3 mm pitch any SMT device
Test Sockets, Burn-In Sockets, IC Adaptors, High Temperature Sockets, Chip Adapters, Display Sockets, Standard & Custom Packaging Solutions

Chip Scale Test Socket Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices, etc. Any SMT Device! .2 mm pitch & up
Chip Scale Test Socket for 1 mm or less up to 6.5 mm packages, .2 mm pitch & up
Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM, QFN, Flash Devices, etc.Any SMT Device! <1Ghz to 18.5GhZ
Click here for more info: 1 mm or less to 6.5 mm packages - Chip Scale Test Sockets ...NEW!...Very Small Footprint!!
Click here for more info: 6.7 mm to 13 mm packages - Chip Scale Test Sockets
Click here for more info: 14 mm to 27 mm packages - Chip Scale Test Sockets
Click here for more info: 28 mm to 40 mm packages - Chip Scale Test Sockets
Click here for more info: 41 mm to 55 mm packages - Chip Scale Test Sockets
Click here to See More Options and more info:Aries Gallery of Test & Burn-in Socket Images
. 2 mm pitch & up, Chip Scale Test & Burni-In Socket for 1 mm or less up to 6.5 mm packages
"Aries, a world leader in test socket technology"

Test socket, Burn-in socket, CSP, BGA, LGA, QFN,QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP, SOIC, LCC, PLCC, TO, SMT, PGA, Ball grid Array, Land Grid array, Micro, Micro BGA, BGA, Bump-Array, Test & burn in, Spring Probe, probe, pogo, pin, Aries, Larsen Associates, Chip, Integrated Circuit, IC socketsTest sockets burn-in sockets spring probes pogo pins

Smallest test socket burn-in sockets spring probes pogo pins CSP BGA LGA SMTTest socket, Burn-in socket, CSP, BGA, LGA, QFN,QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP, SOIC, LCC, PLCC, TO, SMT, PGA, Ball grid Array, Land Grid array, Micro, Micro BGA, BGA, Bump-Array, Test & burn in, Spring Probe, probe, pogo, pin, Aries, Larsen Associates, Chip, Integrated Circuit, IC socketsTest socket, Burn-in socket, CSP, BGA, LGA, QFN,QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP, SOIC, LCC, PLCC, TO, SMT, PGA, Ball grid Array, Land Grid array, Micro, Micro BGA, BGA, Bump-Array, Test & burn in, Spring Probe, probe, pogo, pin, Aries, Larsen Associates, Chip, Integrated Circuit, IC sockets
Now available .2 mm pitch and up.

1GHZ or less = DATA SHEET # 23021.pdf

Over 1GHZ up to 18.5GHz = DATA SHEET # 24013.pdf

Features:
For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications.
Any pitch device on 0.20mm pitch or higher.
Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with two stainless steel screws.
The gold over nickel plated compression spring probes leave very small witness marks on the bottom surface of the device solderballs.
Small overall socket size/profile allows maximum number of sockets per BIB and BIBs per oven, while being operator friendly.
Standard molded socket format can accommodate any device package of 6.5mm or smaller, by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers.
Pressure pad compression spring provides proper force against device and allows for height variations in device thickness.
4 Point crown insures scrub on solder oxides.
Signal path during test only 0.077" (1.92mm)
General Specifications:
Molded socket components are UL94V-0 Ultem.
Machined socket components are UL94V-0 PEEK or Torlon.
All hardware is stainless steel.
Compression spring probes are heat treated Beryllium Copper Alloy.
Compression spring probe plating is 30u" min.[0.75um] Gold per Mil-G-45204 over 30u" min. [0.75um] Nickel per SAE-AMSQQ- N-290.
Durability=500,000 cycles min.
Contact Force = 16g per contact on 0.40mm pitch; = 25g per contact on 0.50 - 0.75mm = 25g per contact on 0.80mm pitch or larger
Operating Temperature = -55°C (min.) to 150°C (max.); -67°F (min.) to 302°F (max.).
Typical Average Burn-In Temperature = 150°C Max.
Mounting Considerations:
See PCB FOOTPRINT TOP VIEW for requirements.
Requires two (2) #0-80 screws and PEM nuts for mounting (not supplied). Mounting holes size shown may differ depending on PEM nut selected.
Sockets must be handled with care when mounting or removing sockets to/from BIB to avoid damaging sensitive spring contacts.
Test board PCB dia.: = .025 (0.635mm) (large probe = 0.80mm pitch & larger) = .015 (0.381mm) (small probe = 0.50mm - 0.75mm pitch) = .012 (0.300mm) (small probe = 0.40mm pitch)
Note: Aries specializes in custom design and production.  In addition to the standard products shown on this page, special materials, platings, sizes, and configurations can be furnished, depending on quantities.  Aries reserves the right to change product specifications without notice.
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For Test Sockets over 1 GHz, Click Here
Test socket, Burn-in socket, CSP, BGA, LGA, QFN,QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP, SOIC, LCC, PLCC, TO, SMT, PGA, Ball grid Array, Land Grid array, Micro, Micro BGA, BGA, Bump-Array, Test & burn in, Spring Probe, probe, pogo, pin, Aries, Larsen Associates, Chip, Integrated Circuit, IC sockets

Adaptor Sockets (Any Footprint to Any Footprint, Any Pin to Pin, Any Termination, 26 days),Correct-A-Chip© Adapters, Horizontal and Vertical Display Sockets , Elevated Sockets, Test Sockets. IC, ZIF, BGA, SOIC, LGA, PLCC, QFP ,PQFP, DIP, SIP, PGA, TSOP, TO, SWOIC ASIC Sockets, Ejecting,Oscillator, D-Ram, Pin Carrier Sockets. Headers, high performance production LGA asics sockets, pin ball LGA BGA socket Jumpers and More. Aries is located in Frenchtown, N.J., U.S.A. Microprocessor BGA sockets Ball Grid Array Land grid array
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6/9/14