Aries Chip Scale Test Socket Test Burn-In CSP Micro BGA Test Socket DSP LGA SRAM DRAM Flash Devices 1 mm or less to 6.5 mm .4mm pitch up Larsen Associates

Features:
• For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications.
• Any pitch device on 0.30mm pitch or higher.
• Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with two stainless steel screws.
• The gold over nickel plated compression spring probes leave very small witness marks on the bottom surface of the device solderballs.
• Small overall socket size/profile allows maximum number of sockets per BIB and BIB’s per oven, while being operator friendly.
• Standard molded socket format can accommodate any device package of 6.5mm or smaller, by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers.
• Pressure pad compression spring provides proper force against device and allows for height variations in device thickness.
• 4 Point crown insures “scrub” on solder oxides.
• Signal path during test only 0.077" (1.92mm)
General Specifications:
• Molded socket components are UL94V-0 Ultem.
• Machined socket components are UL94V-0 PEEK or Torlon.
• All hardware is stainless steel.
• Compression spring probes are heat treated Beryllium Copper Alloy.
• Compression spring probe plating is 30u" min.[0.75um] Gold per Mil-G-45204 over 30u" min. [0.75um] Nickel per SAE-AMSQQ- N-290.
• Durability=500,000 cycles min.
• Contact Force = 16g per contact on 0.40mm pitch; = 25g per contact on 0.50 - 0.75mm = 25g per contact on 0.80mm pitch or larger
• Operating Temperature = -55°C (min.) to 150°C (max.); -67°F (min.) to 302°F (max.).
• Typical Average Burn-In Temperature = 150°C Max.
Mounting Considerations:
• See “PCB FOOTPRINT TOP VIEW” for requirements.
• Requires two (2) #0-80 screws and PEM nuts for mounting (not supplied). Mounting holes size shown may differ depending on PEM nut selected.
• Sockets must be handled with care when mounting or removing sockets to/from BIB to avoid damaging sensitive spring contacts.
• Test board PCB dia.: = .025” (0.635mm) (large probe = 0.80mm pitch & larger) = .015” (0.381mm) (small probe = 0.50mm - 0.75mm pitch) = .012” (0.300mm) (small probe = 0.40mm pitch)