ARIES ELECTRONICS / LARSEN ASSOCIATES

Adaptor Sockets ,Correct-A-Chip© Adapters, Horizontal and Vertical Display Sockets, Test Sockets, Burn-in sockets, Chip Scale Test Sockets, burn-in SMT Device Low frequency High Frequency CSP BGA, LGA, RF, ZIF, QFN, SOIC, TSSOP, DFN, PQFP, MLF, µBGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSOP, SOP, LCC, PLCC, TO, RF, ZIF Any Surface Mount smt Package Style with leads or without Leads PGA packaged devices. Standard & Custom Microprocessor BGA sockets Ball Grid Array Land grid array CSP Test Sockets .5 .4 .35 .2 .3 mm pitch any SMT device
Test Sockets, Burn-In Sockets, IC Adaptors, High Temperature Sockets, Chip Adapters, Display Sockets, Standard & Custom Packaging Solutions

Chip Scale Test Socket Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM, QFN, Flash Devices, etc. Any SMT Device! .2 mm pitch & up
Chip Scale Test Socket for up to 40 mm packages, .2 mm pitch & up
Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM, QFN, Flash Devices, etc. Any SMT Device! .2 mm pitch & up
Click here for more info: 1 mm or less to 6.5 mm packages - Chip Scale Test Sockets ...NEW!...Very Small Footprint!!
Click here for more info: 1 mm to 13 mm packages - Chip Scale Test Sockets
Click here for more info: 14 mm to 27 mm packages - Chip Scale Test Sockets
Click here for more info: for up to 40 mm packages - Chip Scale Test Sockets
Click here for more info: 28 mm to 55 mm packages - Chip Scale Test Sockets
Click here to See More Options and more info:Aries Gallery of Test & Burn-in Socket Images
Chip Scale Test Socket for up to 40 mm packages "Aries, world leader in test socket technology"
Now available .2 mm pitch and up.

1GHZ or less = DATA SHEET# 23019.pdf

Over 1GHZ up to 18.5GHz = DATA SHEET # 24011.pd

FEATURES:
¥ For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM
and Flash Devices.
¥ Any pitch device on 0.20mm or larger.
¥ 4 Point crown insures ÒscrubÓ on solder oxides.
¥ Single Point Probes available for small land area contact pads.
¥ Signal path during test only .077Ó (1.92mm)
¥ Socket is easily mounted and removed to & from the BIB due to solderless
pressure mount compression spring probes which, are accurately
located by two molded plastic alignment pins and mounted
with four stainless steel screws.
¥ The gold over nickel plated compression spring probes leave very
small witness marks on the bottom surface of the device solderballs.
¥ Standard molded socket format can accommodate any device package
of 40mm or smaller.
¥ Pressure pad compression spring provides proper force against
device and allows for height variations in device thickness.

GENERAL SPECIFICATIONS:
¥ Molded socket components are UL94V-0 PEEK and/or Ultem.
¥ 1dB Bandwidth at 1Ghz (0.80mm pitch) (large probe).
¥ Estimated Contact Life: =500,000 cycles.
¥ Compression spring probes are heat treated Beryllium Copper Alloy
with 30uÓ min. [.75um] Gold per Mil-G-45204 over 30uÓ min.[.75um]
Nickel per QQ-N-290.
¥ Contact Force = 9-12g per contact on 0.50 - 0.75mm pitch
17-20g per contact on 0.80mm pitch or larger.
¥ Operating Temperature = -55°C (min.) to 150°C (max.); -67°F (min.)
to 302°F (max.).
¥ All Hardware is Stainless Steel.
¥ Typical Burn-in Temperature = 125°C.

Note: Aries specializes in custom design and production.  In addition to the standard products shown on this page, special materials, platings, sizes, and configurations can be furnished, depending on quantities.  Aries reserves the right to change product specifications without notice.
EZ Quote Request
or Contact us by email
Back to top of page / Selection Guide /
For Test Sockets over 1 GHz, Click Here

Adaptor Sockets (Any Footprint to Any Footprint, Any Pin to Pin, Any Termination, 26 days),Correct-A-Chip© Adapters, Horizontal and Vertical Display Sockets , Elevated Sockets, Test Sockets. IC, ZIF, BGA, SOIC, LGA, PLCC, QFP ,PQFP, DIP, SIP, PGA, TSOP, TO, SWOIC ASIC Sockets, Ejecting,Oscillator, D-Ram, Pin Carrier Sockets. Headers, high performance production LGA asics sockets, pin ball LGA BGA socket Jumpers and More. Aries is located in Frenchtown, N.J., U.S.A. Microprocessor BGA sockets Ball Grid Array Land grid array
For Contact LARSEN ASSOCIATES
-
Catalogs Phone 650 358-9559
-
Quotations

E-Mail

-

Engineering

Web Site

-
Sales
-
Information
-

Distributor list

-

Data Sheets



Copyright © 1988-2014 LARSEN ASSOCIATES

6/9/14