FEATURES:
• For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM
and Flash Devices.
• Any pitch device on 0.30mm or larger.
• 4 Point crown insures “scrub” on solder oxides.
• Single Point Probes available for small land area contact pads.
• Signal path during test only .077” (1.92mm)
• Socket is easily mounted and removed to & from the BIB due to solderless
pressure mount compression spring probes which, are accurately
located by two molded plastic alignment pins and mounted
with four stainless steel screws.
• The gold over nickel plated compression spring probes leave very
small witness marks on the bottom surface of the device solderballs.
• Standard molded socket format can accommodate any device package
of 40mm or smaller.
• Pressure pad compression spring provides proper force against
device and allows for height variations in device thickness.

GENERAL SPECIFICATIONS:
• Molded socket components are UL94V-0 PEEK and/or Ultem.
• 1dB Bandwidth at 1Ghz (0.80mm pitch) (large probe).
• Estimated Contact Life: =500,000 cycles.
• Compression spring probes are heat treated Beryllium Copper Alloy
with 30u” min. [.75um] Gold per Mil-G-45204 over 30u” min.[.75um]
Nickel per QQ-N-290.
• Contact Force = 9-12g per contact on 0.50 - 0.75mm pitch
17-20g per contact on 0.80mm pitch or larger.
• Operating Temperature = -55°C (min.) to 150°C (max.); -67°F (min.)
to 302°F (max.).
• All Hardware is Stainless Steel.
• Typical Burn-in Temperature = 125°C.