For Test & Burn-In of CSP,
MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices.
¥ Any pitch device on 0.20mm pitch or higher.
Socket is easily mounted and removed
to & from the BIB due to solderless pressure mount
compression spring probes which, are accurately located by two
molded plastic alignment pins and mounted with four stainless
The gold over nickel plated
compression spring probes leave very small witness marks on the
bottom surface of the device solderballs.
Small overall socket size/profile
allows maximum number of sockets per BIB and BIB’s per
oven, while being operator friendly.
Standard molded socket format can
accommodate any device package of 13mm or smaller, by using
machined (for small quantities) or custom molded (for large
quantities) pressure pads and interposers.
Pressure pad compression spring
provides proper force against device and allows for height
variations in device thickness.
4 Point crown insures
scrub” on solder oxides.
Signal path during test only
socket components are UL94V-0 Ultem.
Machined socket components are
UL94V-0 PEEK or Torlon.
All hardware is stainless steel.
Compression spring probes are heat
treated Beryllium Copper Alloy.
Compression spring probe plating is
30u” min.[.75um] Gold per Mil-G-45204 over 30u”
min. [.75um] Nickel per QQ-N-290.
Durability=500,000 cycles min.
Contact Force = 9-12g per
contact.0.50 - 0.75mm Pitch; 17-20g per contact on 0.80mm pitch
Operating Temperature = -55°C
(min.) to 150°C (max.); -67°F (min.) to 302°F
Typical Average Burn-In Temperature =
See “PCB FOOTPRINT TOP
VIEW” for requirements.
Requires (4) Four #2-56 screws and
PEM nuts for mounting (mounting holes size shown may differ
depending on PEM nut selected).
Sockets must be handled with care
when mounting or removing sockets to/from BIB to avoid damaging
sensitive spring contacts.
Test board PCB diameter =
.026” (0.66mm) (large probe)
.016” (0.40mm) (small probe)