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Aries Chip Scale Test Sockets:
Spring Probes, Data Sheets, & Test Reports

Chip Scale Test Sockets & Burn-In sockets for MicroBGA, DSP, LGA, SRAM, DRAM, QFN, Flash Devices, ANY SMT device 0.2mm Pitch & Up.
"Aries, world leader in test socket technology"

Now available .2mm pitch and up. .



The family of Aries Clamshell style test sockets consist of five standard sizes of sockets each accommodating a wide range of devices. The socket is screwed to the board with four screws. Electrical contact is by way of pressure spring probes. The sockets are designed to be modified to work with BGAs or LGAs or just about any other type of SMT device regardless of footprint, from 1mm sq up to as large as 55mm square. The exterior of the sockets are standard, and the interior interposer, and the pressure plate, and device guides, are modified to accommodate the users particular style of device, 0.2 mm pitch & up


Hand Test socket and Burn-in socket made in the USAShows Spring Probes, top and bottom, typical of the Aries Clamshell type test socket family.
( Shown above: Test socket for 14mm to 27mm sq devices, Data sheet 23018)



Spring Probe Pins not pogo pins, size .2 mm .3 mm .4 mm ..5mm .65mm .8mm 1.0mm 1.27mm any pitch from Aries Electronics and Larsen Associates
Now available .2mm pitch and up. .


Protect-A Probe coating lessens or eliminates probe cleaning with an anti-diffusion gold coating barrier lessens or eliminates cleaning reduces downtime and increases throughput


Protect-A-Probe™ anti-diffusion, gold coating for its complete line of burn-in and test socket spring-probes.

The Protect-A Probe™ coating is designed to lessen or eliminate the need for probe cleaning, by applying its proprietary, anti-diffusion, gold coating onto the probe before assembly. This coating, once applied, acts like a “Teflon” barrier preventing solder and other debris from adhering to the probe tip. This lessens (or eliminates) cleaning, which reduces downtime and increases throughput!

When used in HAST, HTOL or standard burn-in applications this can prevent the IC solder balls/bumps from “sticking” to the probe causing damage to the IC and/or socket. When used in test (including RF testing) applications, a probe that stays cleaner, longer, will yield more consistent contact resistance (CRes) readings over a longer period of time. This saves time and money.

This coating has been tested in a socket with an IC which had SAC405 balls on 0.35mm pitch for over 1500 hours at 150°C. No debris or IC or socket damage was noticed.

This coating is now available for the Aries’ complete line of spring-probe, standard and custom Test and Burn-in Sockets as well as the complete line of spring-probe based RF Test Sockets.


DATA SHEETS

- Generic Data Sheets:
Note: Please review the data sheets below. The drawing on the data sheet for the standard ized body molded sockets shows layout of the socket less the interior portion that is modified for your exact device. For your layout, the center datum point is a common dimension for both the IC and socket. Actual drawings with your device are generated for your approval after receipt of order. Fully machined sockets can be any layout and size. Custom sockets are to your exact needs.

Device Up to 6.5 mm sq
23021 Style: Under 1 GHz http://www.arieselec.com/products/data/23021-csp-micro-bga-test-burn-in-socket.pdf

24008 Style: Over 1GHz up to 18 GHz http://www.arieselec.com/products/data/24008-high-frequency-test-socket.pdf

Device Up to 13 mm
23017 Style: Under 1 GHz http://www.arieselec.com/products/data/23017-csp-micro-bga-test-burn-in-socket.pdf

24008 Style: Over 1GHz up to 18 GHz http://www.arieselec.com/products/data/24008-high-frequency-test-socket.pdf

Device Up to 27 mm
23018 Style: Under 1 GHz http://www.arieselec.com/products/data/23018-csp-micro-bga-test-burn-in-socket.pdf

24009 Style: Over 1GHz up to 18 GHz http://www.arieselec.com/products/data/24009-high-frequency-test-socket.pdf

Device Up to 40 mm
23019 Style: Under 1 GHz http://www.arieselec.com/products/data/23019-csp-micro-bga-test-burn-in-socket.pdf

24011 Style: Over 1GHz up to 18 GHz http://www.arieselec.com/products/data/24011-csp-micro-bga-test-socket.pdf

Device Up to 55 mm
23020 Style: Under 1 GHz http://www.arieselec.com/products/data/23020-csp-micro-bga-test-burn-in-socket.pdf

24012 Style: Over 1GHz up to 18 GHz http://www.arieselec.com/products/data/24012-csp-bga-high-frequency-test-socket.pdf

RF Machined Socket
24010 Style: http://www.arieselec.com/products/data/24010-csp-bga-high-frequency-test-and-burn-in-socket.pdf

Kelvin Contacts
23022 Style: http://www.arieselec.com/products/data/23022-kelvin-test-socket.pdf

Optical FA Lens
23023 Style: http://www.arieselec.com/products/data/23023-csp-test-socket.pdf

CSP Hybrid
23016 Style: http://www.arieselec.com/products/data/23016-csp-hybrid-socket.pdf

Silmat:High Temperature 200C
23026 Style: http://www.arieselec.com/products/data/23026-bga-high-temp-burn-in-and-test-socket.pdf

Adjustable Z axis:
23018 Style: http://www.arieselec.com/products/data/23018-app-adjustable-csp-micro-bga-test-burn-in-socket.pdf

24009 Style: http://www.arieselec.com/products/data/24009-app-adjustable-high-frequency-test-socket.pdf


All Test Reports
TEST REPORTS

Microstrip CSP Socket DC Cycling
Microstrip CSP Socket DC Measurement
Microstrip CSP Socket RF Cycling
Microstrip QFP 0.5mm 64-pin Socket Electrical Characterization
Microstrip QFP 0.5mm Socket Return Loss Graph
Microstrip QFP Socket DC Cycling
Microstrip QFP Socket RF Cycling
Microstrip QFP Socket RF Measurement
Microstrip SSOP 20-pin 0.65mm pitch Socket Return Loss Graph
Microstrip SSOP 20-pin Test Socket Electrical Characterization

Center Probe 0.5mm BGA Socket Electrical Performance
Center Probe 0.5mm Socket Return Loss Graph
Center Probe BGA 0.8mm Socket Electrical Characterization
Center Probe Contacts Decibel Frequency Graph
Center Probe CSP Socket DC Cycling
Center Probe CSP Socket DC Measurement
Center Probe CSP Socket RF Measurement
Center Probe CSP Socket RF Cycling

Kapton CSP RF Measurement
Kapton CSP Socket DC Cycling
Kapton CSP Socket DC Measurement
Kapton CSP Socket RF Cycling
Kapton Interposer 0.5mm Socket Electrical Characterization
Kapton Interposer Decibel Graph
Kapton QFP Microstrip Socket DC Measurement
Kapton QFP Socket DC Cycling
Kapton QFP Socket DC Measurement
Kapton QFP Socket RF Cycling
Kapton QFP Socket RF Measurement

ASSEMBLY DESIGN

Microstrip Large RF Socket Assembly and Footprint
Microstrip Medium RF Socket Assembly and Footprint
Microstrip QFP Std Hinge Lid Assembly
Microstrip Small RF Socket Assembly and Footprint

RF MICROSTRIP CONTACT

Signal Path Length: 0.005" and 0.007"
Operating Temperature: -55°C to +150°C
Insertions: 500,000
Self-Inductance: 0.01nH
Bandwidth: 16GHz at -1dB (0.50mm pitch)
Contact Resistance: <70 milliohms

RF CENTER PROBE CONTACT

Signal Path Length: as short as 0.077"
Operating Temperature: -55°C to +150°C
Insertions: >500,000
Self-Inductance: 0.51nH
Bandwidth: 18.0GHz at -1dB (0.5mm pitch)
Contact Resistance: <70 milliohms

RF KAPTON INTERPOSER

Signal Path Length: as short as 0.011"
Operating Temperature: -40°C to 150°C
Insertions: >50,000
Self-Inductance: 0.09nH
Bandwidth: 40GHz at -1dB
Contact Resistance: <40 milliohms

CLEANING PROCEDURE (PDF Version)

LOADBOARD DESIGN GUIDELINES


IC test sockets and burn-in sockets family from Aries Larsen
Chip Scale Test Sockets Test & Burn-In of BGA, MicroBGA, LGA, DSP, QFN, QFP, SRAM, DRAM, LCC, MLF, Flash Devices, & More
For Any SMT device, .2 mm pitch & up.


CLICK here for More RF Test sockets over 1 GHz
INFO: Reliability and Performance: Two Key Considerations in Evaluating High Performance Test Sockets
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7/7/15