ARIES ELECTRONICS / LARSEN ASSOCIATES

Adaptor Sockets ,Correct-A-Chip© Adapters, Horizontal and Vertical Display Sockets, Test Sockets, Burn-in sockets, Chip Scale Test Sockets, burn-in SMT Device Low frequency High Frequency CSP BGA, LGA, RF, ZIF, QFN, SOIC, TSSOP, DFN, PQFP, MLF, µBGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSOP, SOP, LCC, PLCC, TO, RF, ZIF Any Surface Mount smt Package Style with leads or without Leads PGA packaged devices. Standard & Custom Microprocessor BGA sockets Ball Grid Array Land grid array CSP Test Sockets .5 .4 .35 .2 .3 mm pitch any SMT device
Test Sockets, Burn-In Sockets, IC Adaptors, High Temperature Sockets, Chip Adapters, Display Sockets, Standard & Custom Packaging Solutions

Chip Scale Test Socket for 14 mm to 27 mm packages .2 mm pitch & up
Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM, QFN, Flash Devices, etc. Any SMT Device! .2 mm pitch & up
Click here for more info: 1 mm or less to 6.5 mm packages - Chip Scale Test Sockets ...NEW!...Very Small Footprint!!
Click here for more info: 1 mm to 13 mm packages - Chip Scale Test Sockets
Click here for more info: 14 mm to 27 mm packages - Chip Scale Test Sockets
Click here for more info: for up to 40 mm packages - Chip Scale Test Sockets
Click here for more info: 28 mm to 55 mm packages - Chip Scale Test Sockets
Click here to See More Options and more info:Aries Gallery of Test & Burn-in Socket Images
.3 mm pitch & up, Chip Scale Test Socket for 14 mm to 27 mm packages
"Aries, a world leader in test socket technology"

Test socket, Burn-in socket, CSP, BGA, LGA, QFN,QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP, SOIC, LCC, PLCC, TO, SMT, PGA, Ball grid Array, Land Grid array, Micro, Micro BGA, µBGA, Bump-Array, Test & burn in, Spring Probe, probe, pogo, pin, Aries, Larsen Associates, Chip, Integrated Circuit, IC sockets

Now available .2 mm pitch and up.

1GHZ or less = DATA SHEET# 23018.pdf

Over 1GHZ up to 18.5GHz = DATA SHEET # 24009.pdf


Features:
For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. ¥ Any pitch device on 0.20mm or larger. • Pressure mounting, no soldering required. • 4 Point crown insures scrub” on solder oxides. • Signal path during test only .077” (1.92mm) • Accommodates any package up to 27mm2. • Small overall socket size/profile allows maximum number of sockets per BIB and BIB’s per oven, while being operator friendly.
Specifications:
Molded socket components are UL94V-0 PEEK and/or Ultem. • 1dB Bandwidth at 1Ghz  (0.80mm pitch) (large probe). • Estimated Contact  Life: = 500,000 cycles. • Compression spring probes are heat treated Beryllium Copper Alloy with 30u” min. [.75um] Gold per Mil-G-45204 over 30u” min.[.75um] Nickel per QQ-N-290. • Contact Force = 9-12g per contact on 0.50 - 0.75mm pitch    17-20g per contact on 0.80mm pitch or larger. • Operating Temperature = -55°C (min.) to 150°C (max.); -67°F (min.) to 302°F (max.). • All Hardware is Stainless Steel. • Typical Burn-in Temperature = 125°C. Mounting Considerations: • Aries supplies (4) four #4-40 screws and tapped, insulated, backing plate for mounting. • Sockets must be handled with care when mounting or removing    sockets to/from PCB. • Test board PCB diameter = .026” (0.66mm) (large probe)                                           = .016” (0.40mm) (small probe)

Note: Aries specializes in custom design and production.  In addition to the standard products shown on this page, special materials, platings, sizes, and configurations can be furnished, depending on quantities.  Aries reserves the right to change product specifications without notice.
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For Test Sockets over 1 GHz, Click Here

Adaptor Sockets (Any Footprint to Any Footprint, Any Pin to Pin, Any Termination, 26 days),Correct-A-Chip© Adapters, Horizontal and Vertical Display Sockets , Elevated Sockets, Test Sockets. IC, ZIF, BGA, SOIC, LGA, PLCC, QFP ,PQFP, DIP, SIP, PGA, TSOP, TO, SWOIC ASIC Sockets, Ejecting,Oscillator, D-Ram, Pin Carrier Sockets. Headers, high performance production LGA asics sockets, pin ball LGA BGA socket Jumpers and More. Aries is located in Frenchtown, N.J., U.S.A. Microprocessor BGA sockets Ball Grid Array Land grid array
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6/9/14