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Standard and Custom Adaptors, Sockets and Interconnect Packaging Solutions

Test Sockets. Burn-in sockets IC, ZIF, QFN, MLF, BGA, SOIC, LGA, PLCC, QFP ,PQFP, DIP, SIP, PGA, TSOP, TO, SWOIC ASIC Sockets, Ejecting,Oscillator, D-Ram, Pin Carrier Sockets. Headers, high performance production LGA asics sockets, Jumpers and More. Aries is located in Frenchtown, N.J., U.S.A. Microprocessor

.2 mm pitch & up, CSP Test and Burn-In Sockets, For Any SMT Device! The big Pictures

test and burn in burn-in socket sockets for µBGA Adapter ASIC BGA CGA CPGA CSP DIE DO DRAM EXP FBGA FCBGA flash Flat Pac FLGA Handlers HAST HQFP HSOF I-lead IR JEDEC JEITA  J-lead J-lead LCC lead Leadless LGA LPCC LQFP MCP MDDS micro BGA Micro-array MicroSMD MLP Mult-Chip Package optical PBGA P-BGA P-BGA PGA PLCC PQFP QFI QFJ QFN QFP Quad SC SMT SO SoC Socket SOD SOI SOIC SOJ SON SOP SOT SOT SRAM SSOP SZIP TAB T-BGA TCP TEP tin gold ROHS TO Top Exposed Pad TQFP TSOP TSSOP Wafer W-CSP Zig-Zag ZIPburn-in burn in test socket sockets for µBGA Adapter ASIC BGA CGA CPGA CSP DIE DO DRAM EXP FBGA FCBGA flash Flat Pac FLGA Handlers HAST HQFP HSOF I-lead IR JEDEC JEITA  J-lead J-lead LCC lead Leadless LGA LPCC LQFP MCP MDDS micro BGA Micro-array MicroSMD MLP Mult-Chip Package optical PBGA P-BGA P-BGA PGA PLCC PQFP QFI QFJ QFN QFP Quad SC SMT SO SoC Socket SOD SOI SOIC SOJ SON SOP SOT SOT SRAM SSOP SZIP TAB T-BGA TCP TEP tin gold ROHS TO Top Exposed Pad TQFP TSOP TSSOP Wafer W-CSP Zig-Zag ZIP

Back to Aries BGA / LGA / CSP Selection guide, click here.

test socket test and burn in sockets for µBGA Adapter ASIC BGA CGA CPGA CSP DIE DO DRAM EXP FBGA FCBGA flash Flat Pac FLGA Handlers HAST HQFP HSOF I-lead IR JEDEC JEITA  J-lead J-lead LCC lead Leadless LGA LPCC LQFP MCP MDDS micro BGA Micro-array MicroSMD MLP Mult-Chip Package optical PBGA P-BGA P-BGA PGA PLCC PQFP QFI QFJ QFN QFP Quad SC SMT SO SoC Socket SOD SOI SOIC SOJ SON SOP SOT SOT SRAM SSOP SZIP TAB T-BGA TCP TEP tin gold ROHS TO Top Exposed Pad TQFP TSOP TSSOP Wafer W-CSP Zig-Zag ZIP

test socket sockets test and burn-in clamshell open top for µBGA Adapter ASIC BGA CGA CPGA CSP DIE DO DRAM EXP FBGA FCBGA flash Flat Pac FLGA Handlers HAST HQFP HSOF I-lead IR JEDEC JEITA  J-lead J-lead LCC lead Leadless LGA LPCC LQFP MCP MDDS micro BGA Micro-array MicroSMD MLP Mult-Chip Package optical PBGA P-BGA P-BGA PGA PLCC PQFP QFI QFJ QFN QFP Quad SC SMT SO SoC Socket SOD SOI SOIC SOJ SON SOP SOT SOT SRAM SSOP SZIP TAB T-BGA TCP TEP tin gold ROHS TO Top Exposed Pad TQFP TSOP TSSOP Wafer W-CSP Zig-Zag ZIP

SPRING Probes pogo pins test burn-in burn in socket sockets for µBGA Adapter ASIC BGA CGA CPGA CSP DIE DO DRAM EXP FBGA FCBGA flash Flat Pac FLGA Handlers HAST HQFP HSOF I-lead IR JEDEC JEITA  J-lead J-lead LCC lead Leadless LGA LPCC LQFP MCP MDDS micro BGA Micro-array MicroSMD MLP Mult-Chip Package optical PBGA P-BGA P-BGA PGA PLCC PQFP QFI QFJ QFN QFP Quad SC SMT SO SoC Socket SOD SOI SOIC SOJ SON SOP SOT SOT SRAM SSOP SZIP TAB T-BGA TCP TEP tin gold ROHS TO Top Exposed Pad TQFP TSOP TSSOP Wafer W-CSP Zig-Zag ZIP

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Back to Aries BGA / LGA / CSP Selection guide, click here.



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4/25/14