ARIES ELECTRONICS / LARSEN ASSOCIATES

Adaptor Sockets ,Correct-A-Chipİ Adapters, Horizontal and Vertical Display Sockets, Test Sockets, Burn-in sockets, Chip Scale Test Sockets, burn-in SMT Device Low frequency High Frequency CSP BGA, LGA, RF, ZIF, QFN, SOIC, TSSOP, DFN, PQFP, MLF, µBGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSOP, SOP, LCC, PLCC, TO, RF, ZIF Any Surface Mount smt Package Style with leads or without Leads PGA packaged devices. Standard & Custom Microprocessor BGA sockets Ball Grid Array Land grid array CSP Test Sockets .5 .4 .35 .2 .3 mm pitch any SMT device
Test Sockets, Burn-In Sockets, IC Adaptors, High Temperature Sockets, Chip Adapters, Display Sockets, Standard & Custom Packaging Solutions

"Aries, the world leader in spring probe LGA Test and Burn-In Socket technology"
LGA Test Sockets
- For any SMT Device!
- 0.2 mm pitch & up-
- Low or High Frequency,
- Standard & Custom
CSP, Chip Scale, BGA, LGA, RF, ZIF, QFN, SOIC, TSSOP, DFN, PQFP, MLF, µBGA, Micro BGA, DSP, LGA, SRAM, DRAM, Bump-Array, QFN, QFP, MLF, DFN, SSOP, Flash Devices, TSOP, SOP, LCC, PLCC, TO, RF, ZIF and Any Surface Mount smt Package Style with leads or without Leads plus most PGA packaged devices. Any SMT Device! <1Ghz to 18.5GhZ



Now available .3 mm pitch & up ---- 20 Day Standard Delivery, 15, or 10 Day Delivery Available.
-"Fast, Economical, Cost Effective, All Available from under 1Ghz & available up to 18.5GHz"
Click here to See More Options and more info:Aries Gallery of Test & Burn-in Socket Images

Test socket, Burn-in socket, CSP, BGA, LGA, QFN,QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP, SOIC, LCC, PLCC, TO, SMT, PGA, Ball grid Array, Land Grid array, Micro, Micro BGA, µBGA, Bump-Array, Test & burn in, Spring Probe, probe, pogo, pin, Aries, Larsen Associates, Chip, Integrated Circuit, IC sockets
Click image for larger view
............. NEW! .............VERY EXTRA SMALL FOOTPRINT
-For from 1 mm or less packages up to 6.5 mm packages
- .3 mm pitch & up

-Chip Scale to fit any package footprint. For Any SMT device, LGA, BGA or any other Contact style. Now .3mm pitch and up

1GHZ or less = DATA SHEET # 23021.pdf

Over 1GHZ up to 18.5GHz = DATA SHEET # 24013.pdf

-More Info

-EZ Quote Request


Test socket, Burn-in socket, CSP, BGA, LGA, QFN,QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP, SOIC, LCC, PLCC, TO, SMT, PGA, Ball grid Array, Land Grid array, Micro, Micro BGA, µBGA, Bump-Array, Test & burn in, Spring Probe, probe, pogo, pin, Aries, Larsen Associates, Chip, Integrated Circuit, IC sockets
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SMALL
-For 6.6 mm packages up to 13 mm packages, .2 mm pitch & up

-Chip Scale to fit any package footprint. For Any SMT device, LGA, BGA or any other Contact style. Now .3mm pitch and up. More Info

1GHZ or less = DATA SHEET# 23017.pdf

Over 1GHZ up to 18.5GHz = DATA SHEET # 24008.pdf

-EZ Quote Request


Test socket, Burn-in socket, CSP, BGA, LGA, QFN,QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP, SOIC, LCC, PLCC, TO, SMT, PGA, Ball grid Array, Land Grid array, Micro, Micro BGA, µBGA, Bump-Array, Test & burn in, Spring Probe, probe, pogo, pin, Aries, Larsen Associates, Chip, Integrated Circuit, IC sockets
Click image for larger view

MEDIUM
-For 14 mm packages up to 27 mm packages, .2 mm pitch & up

-Chip Scale to fit any package footprint. For Any SMT device,LGA BGA or any other Contact style. Now .3mm pitch and up. More info

1GHZ or less = DATA SHEET# 23018.pdf

Over 1GHZ up to 18.5GHz = DATA SHEET # 24009.pdf

-EZ Quote Request


Test socket, Burn-in socket, CSP, BGA, LGA, QFN,QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP, SOIC, LCC, PLCC, TO, SMT, PGA, Ball grid Array, Land Grid array, Micro, Micro BGA, µBGA, Bump-Array, Test & burn in, Spring Probe, probe, pogo, pin, Aries, Larsen Associates, Chip, Integrated Circuit, IC sockets
Click image for larger view

LARGE
-For 28 mm to 40 mm packages, .2 mm pitch & up

-Chip Scale to fit any package footprint. For Any SMT device,LGA BGA or any other Contact style, Now .3mm pitch and up. More Info

1GHZ or less = DATA SHEET# 23019.pdf

Over 1GHZ up to 18.5GHz = DATA SHEET # 24011.pdf

-EZ Quote Request


Test socket, Burn-in socket, CSP, BGA, LGA, QFN,QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP, SOIC, LCC, PLCC, TO, SMT, PGA, Ball grid Array, Land Grid array, Micro, Micro BGA, µBGA, Bump-Array, Test & burn in, Spring Probe, probe, pogo, pin, Aries, Larsen Associates, Chip, Integrated Circuit, IC sockets
Click image for larger view

Extra - LARGE
-For 41 mm packages up to 55 mm packages. .2 mm pitch & up

-Chip Scale to fit any package footprint. For Any SMT device,LGA BGA or any other Contact style. Now .3mm pitch and up. More Info

1GHZ or less = DATA SHEET# 23020.pdf

Over 1GHZ up to 18.5GHz = DATA SHEET # 24012.pdf

-EZ Quote Request


Aries Chip Scale Test Sockets: Spring Probes, Data Sheets, & Test Reports
Spring probes test sockets burn-in sockets pogo pins high frequwency low frequency RF
Aries Spring probes for LGA devices are generally the sharp tip or flat tip probes shown above. Now from an amazing .2 mm pitch and up.

Click here for more info: 1 mm or less to 6.5 mm packages - Chip Scale Test Sockets ...NEW!...Very Small Footprint!!
Click here for more info: 6.6 mm to 13 mm packages - Chip Scale Test Sockets
Click here for more info: 14 mm to 27 mm packages - Chip Scale Test Sockets
Click here for more info: 28 mm to 40 mm packages - Chip Scale Test Sockets
Click here for more info: 41 mm to 55 mm packages - Chip Scale Test Sockets
For More Test Sockets over 1 GHz, Click Here


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6/9/14