ARIES ELECTRONICS / LARSEN ASSOCIATES
Chip Scale LGA Test Sockets & Burn-In Sockets CSP, Micro BGA, DSP, LGA, SRAM, DRAM, QFN, Flash Devices, etc. Any SMT Device!

"Aries, the world leader in spring probe LGA Test and Burn-In Socket technology"
.3 mm pitch & up, Chip Scale LGA Test Socket & LGA Burn-in Sockets for 1 mm or less, up to 55 mm packages
LGA Test Sockets
Also for CSP, MicroBGA, DSP, LGA, SRAM, DRAM, QFN, Flash Devices, etc. Any SMT Device! <1Ghz to 18.5GhZ
Now available .3 mm pitch & up ---- 20 Day Standard Delivery, 15, or 10 Day Delivery Available.
-"Fast, Economical, Cost Effective, All Available from under 1Ghz & available up to 18.5GHz"
Click here to See More Options and more info:Aries Gallery of Test & Burn-in Socket Images

Click image for larger view		 ............. NEW! .............VERY EXTRA SMALL FOOTPRINT
-For from 1 mm or less packages up to 6.5 mm packages
- .3 mm pitch & up

-Chip Scale to fit any package footprint. For Any SMT device, LGA, BGA or any other Contact style. Now .3mm pitch and up

1GHZ or less = DATA SHEET # 23021.pdf

Over 1GHZ up to 18.5GHz = DATA SHEET # 24013.pdf

-More Info

-EZ Quote Request

Click image for larger view
SMALL
-For 6.6 mm packages up to 13 mm packages, .3 mm pitch & up

-Chip Scale to fit any package footprint. For Any SMT device, LGA, BGA or any other Contact style. Now .3mm pitch and up. More Info

1GHZ or less = DATA SHEET# 23017.pdf

Over 1GHZ up to 18.5GHz = DATA SHEET # 24008.pdf

-EZ Quote Request

Click image for larger view

MEDIUM
-For 14 mm packages up to 27 mm packages, .3 mm pitch & up

-Chip Scale to fit any package footprint. For Any SMT device,LGA BGA or any other Contact style. Now .3mm pitch and up. More info

1GHZ or less = DATA SHEET# 23018.pdf

Over 1GHZ up to 18.5GHz = DATA SHEET # 24009.pdf

-EZ Quote Request

Click image for larger view

LARGE
-For 28 mm to 40 mm packages, .3 mm pitch & up

-Chip Scale to fit any package footprint. For Any SMT device,LGA BGA or any other Contact style, Now .3mm pitch and up. More Info

1GHZ or less = DATA SHEET# 23019.pdf

Over 1GHZ up to 18.5GHz = DATA SHEET # 24011.pdf

-EZ Quote Request


Click image for larger view
Extra - LARGE
-For 41 mm packages up to 55 mm packages. .3 mm pitch & up

-Chip Scale to fit any package footprint. For Any SMT device,LGA BGA or any other Contact style. Now .3mm pitch and up. More Info

1GHZ or less = DATA SHEET# 23020.pdf

Over 1GHZ up to 18.5GHz = DATA SHEET # 24012.pdf

-EZ Quote Request

Aries Chip Scale Test Sockets: Spring Probes, Data Sheets, & Test Reports
Aries Spring probes for LGA devices are generally the sharp tip or flat tip probes shown above. Now from an amazing .3 mm pitch and up.
Click here for more info: 1 mm or less to 6.5 mm packages - Chip Scale Test Sockets ...NEW!...Very Small Footprint!!
Click here for more info: 6.6 mm to 13 mm packages - Chip Scale Test Sockets
Click here for more info: 14 mm to 27 mm packages - Chip Scale Test Sockets
Click here for more info: 28 mm to 40 mm packages - Chip Scale Test Sockets
Click here for more info: 41 mm to 55 mm packages - Chip Scale Test Sockets
For More Test Sockets over 1 GHz, Click Here
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11/14/09