ARIES ELECTRONICS / LARSEN ASSOCIATES

Adaptor Sockets ,Correct-A-Chip© Adapters, Horizontal and Vertical Display Sockets, Test Sockets, Burn-in sockets, Chip Scale Test Sockets, burn-in SMT Device Low frequency High Frequency CSP BGA, LGA, RF, ZIF, QFN, SOIC, TSSOP, DFN, PQFP, MLF, µBGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSOP, SOP, LCC, PLCC, TO, RF, ZIF Any Surface Mount smt Package Style with leads or without Leads PGA packaged devices. Standard & Custom Microprocessor BGA sockets Ball Grid Array Land grid array CSP Test Sockets .5 .4 .35 .2 .3 mm pitch any SMT device
Test Sockets, Burn-In Sockets, IC Adaptors, High Temperature Sockets, Chip Adapters, Display Sockets, Standard & Custom Packaging Solutions

- Staggered Row
- Offset Row
- Mixed Pitch
- Fine Pitch
- Chip Scale Test & Burn-In Sockets
- For Any SMT Foortprint Device!
"Aries, the world leader in Fine Pitch,
Staggered Row, Mixed Pitch, .2 mm pitch & up Spring Probe Test & Burn-In Socket Technology"
All Now available with .2mm pitch and up ---- 20, 15, or 10 Day Delivery Available.
Test & Burn-In CSP, MicroBGA, DSP, LGA, SRAM, DRAM, QFN, Flash Devices, etc. Any SMT Device!
Aries also manufactures Test Sockets and Burn-in Sockets for staggered rows of balls, staggered contacts, staggered pads & any not aligned contacts in addition to the usual standard footprints. Mixed pitches, or odd pitches, and staggered rows are not a problem and are standard pricing. Aries easily and routinely manufactures with mixed pitch, or odd pitches, from .3 mm and up with Spring Probes (AKA Pogo Pins). Aries can provide test sockets or burn-in sockets at very reasonable prices for any footprint style for any SMT device from .3mm and up.

Any pitch accomodated from, 0.3mm & Up, including 0.4mm, 0.45mm, 0.5.mm, 0.55mm, 0.6mm, 0.65mm, 0.7mm, 0.75mm, 0.8mm, 0.85mm, 0.9mm, 0.95mm, 1.0 mm, 1.27 mm, 1.5 mm, or any odd, or even pitch, or fine pitch, staggered or not staggered, any fooprint, any SMT device, etc.

The Aries family of CSP Test and Burn-in Sockets consists of 5 different standard socket bodies that accommodate device sizes from 1 mm up to 55 mm, with the interior interposer designed to fit your exact pin pattern regardless if it is standard spacing or so-called non-standard spacing or pitch. For Aries, any spacing, and any pitch is standard. You can combine any pin arrangement from .3mm pitch and up, any odd pitch, multiple pitch, with staggered rows, alternating rows, non-aligned rows, with mixed pitches and footprints of any design. Plus Cycle life up to 500,000 cycles. You found your socket company.
Contact us today.


Aries Spring Probes are now available on .3 mm pitch & up, Mixed pitches, Staggered pitches, any combination of sizes and configurations.


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VERY EXTRA SMALL FOOTPRINT
- For from 1 mm or less packages up to 6.5 mm packages Now .3 mm pitch & up

- Chip Scale to fit any package footprint.
- For Any SMT device, BGA or any other Contact style.
- Now .3 mm pitch and up.

-"Fast, Economical, Cost Effective, From under 1GHz & available up to 18.5GHz"

1GHZ or less = DATA SHEET # 23021.pdf

Over 1GHZ up to 18.5GHz = DATA SHEET # 24013.pdf



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SMALL
-For 6.6 mm packages up to 13 mm packages .3 mm pitch & up

- Chip Scale to fit any package footprint.
- For Any SMT device, BGA or any other Contact style.
- Now .3 mm pitch and up. More Info

-"Fast, Economical, Cost Effective, From under 1Ghz & available up to 18.5GHz"

1GHZ or less = DATA SHEET# 23017.pdf

Over 1GHZ up to 18.5GHz = DATA SHEET # 24008.pdf

-EZ Quote Request



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MEDIUM
-For 14 mm packages up to 27 mm packages .3 mm pitch & up

- Chip Scale to fit any package footprint.
- For Any SMT device, BGA or any other Contact style.
- Now .3 mm pitch and up. More info

-"Fast, Economical, Cost Effective, From under 1GHz & available up to 18.5GHz"

1GHZ or less = DATA SHEET# 23018.pdf

Over 1GHZ up to 18.5GHz = DATA SHEET # 24009.pdf

-EZ Quote Request



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LARGE
-For 28 mm to 40 mm packages .3 mm pitch & up

- Chip Scale to fit any package footprint.
- For Any SMT device, BGA or any other Contact style.
- Now .3 mm pitch and up. More Info

-"Fast, Economical, Cost Effective, From under 1GHz & available up to 18.5GHz"

1GHZ or less = DATA SHEET# 23019.pdf

Over 1GHZ up to 18.5GHz = DATA SHEET # 24011.pdf

-EZ Quote Request



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Extra - LARGE
-For 41 mm packages up to 55 mm packages. .3 mm pitch & up

- Chip Scale to fit any package footprint.
- For Any SMT device, BGA or any other Contact style.
- Now .3 mm pitch and up. More Info

-"Fast, Economical, Cost Effective, From under 1GHz & available up to 18.5GHz"

1GHZ or less = DATA SHEET# 23020.pdf

Over 1GHZ up to 18.5GHz = DATA SHEET # 24012.pdf

-EZ Quote Request


Test & Burn-In CSP, MicroBGA, DSP, LGA, SRAM, DRAM, QFN, Flash Devices, etc. Any SMT Device! <1Ghz to 18.5GhZ
Click here for more info: 1 mm or less to 6.5 mm packages - Chip Scale Test Sockets
Click here for more info: 6.6 mm to 13 mm packages - Chip Scale Test Sockets
Click here for more info: 14 mm to 27 mm packages - Chip Scale Test Sockets
Click here for more info: 28 mm to 40 mm packages - Chip Scale Test Sockets
Click here for more info: 41 mm to 55 mm packages - Chip Scale Test Sockets

For More Test Sockets over 1 GHz, Click Here

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