RoHS-COMPLIANT SSOP ADAPTERS FROM ARIES
ALLOW USERS TO DETERMINE SPECIFIC SIZE

FRENCHTOWN, N.J., -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has introduced a RoHS-compliant version of its SOWIC-to-DIP Correct-A-Chip™ adapter that can be used for prototyping and testing SSOP ICs. The RoHS-compliant adapter allows the use of 0.65 mm pitch surface mount ICs in thru-hold designs, and can be cut to smaller sizes by the end user.

The body of the new adapter is constructed of 1.58 mm (0.062”) FR406 or IS410 per IPC 4101A/26 with one ounce of copper traces on both sides. Its pins are 360-1/2 hard brass alloy per UNS C36000 ASTM-B16-85 with 10 µ” minimum gold plating per MIL-G-45204 over 100 µ” nickel plating per QQ-N-290. Its current rating is 1 Amp and its operating temperature is 221°F (105°C). The suggested PCB hole diameter is 0.71 mm (0.028”).

Aries will continue to offer the standard non-RoHS compliant version of the adapter for customers who require tin/lead plating. All Aries Correct-A-Chip adapters are available in custom materials, platings, sizes and configurations to suit specific customer applications.

NEW CSP TEST AND BURN-IN SOCKET FROM ARIES
ACCOMMODATES DEVICES FROM 28 mm2 TO 40 mm2

FRENCHTOWN, N.J., -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has introduced a new CSP test socket for devices from 28 mm2 to 40 mm2. The new socket is ideal for manual testing of devices with pitches down to 0.40 mm, such as CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and Flash devices.

The new socket provides minimal signal loss for higher bandwidth capability via a signal path of only .077” (1.95 mm). The socket’s overall size of 3.050” (77.47 mm) x 2.500” (63.50 mm) x 1.271” (32.28 mm) provides the maximum allowable space for board components and connectors.

Solderless, pressure-mount compression spring probes allow the socket to be easily mounted to and removed from the test board. These gold-over-nickel compression spring probe screws leave very small witness marks on the bottom of the device solder balls, and are accurately located by two molded plastic alignment pins and secured with four stainless steel screws.

The 4-point spring probe crown on the new socket ensures “scrub” on solder ball oxides for reliable contact mating, and the pointed probe works with LGAs, MLFs and other device types.

The compression spring probes are heat-treated beryllium copper alloy, plated with
30 µ” min. (0.75 µm) gold per Mil-G-45204 over 30 µ” min. (0.75 µm) nickel per QQ-N-290. The socket’s molded components are UL94V-0 PEEK and/or Ultem. All hardware is stainless steel.

Contact forces of the new sockets are 16g per contact for 0.40mm pitch and 25g per contact for 0.50mm pitches and larger. Operating temperature is -55°C to +150°C (-67°F to +302°F). Estimated contact life is over 500,000 cycles.

Pricing for a 100-pin socket starts at $170.00. Delivery is four to six weeks ARO.

ARIES ELECTRONICS INTRODUCES
RoHS-COMPLIANT DIP TO SOIC ADAPTER

FRENCHTOWN, N.J., -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has introduced a RoHS-compliant version of its DIP to SOIC Correct-A-Chip™ adapter that offers an easy method of converting DIP style packaging to SOIC PCB layouts.
The top of the new RoHS-compliant adapter is available in DIP pin counts from eight through 28 pins, and the bottom solders down on standard SOIC footprints. The socket body of the adapter is black, glass-filled 4/6 nylon and rated UL 94V-0. Its operating temperature is 221F (105C), while its continuous use temperature is 338F (170C).

The PCB is 1.58mm (.062”) thick and flame resistant 4 (FR-4). The new adapter’s female pin plating is 10 (.254m) minimum gold per MIL-G-45204 with 100 (2.54m) minimum nickel per QQ-N-290, and its female contact plating is 10 (.254m) minimum gold per MIL-G-45204 with 50 (1.27m) minimum nickel per QQ-N-290. All tolerances are 0.13 mm (0.005”).

Aries will continue to offer the standard non-RoHS compliant version of the adapter for customers who require tin/lead plating. All Aries Correct-A-Chip adapters are available in custom materials, platings, sizes and configurations to suit specific customer applications. ACCOMMODATES DEVICES FROM 28 mm2 TO 40 mm2

NEW LEAD-FREE BGA TO TIN-LEAD BGA ADAPTER
FROM ARIES ELECTRONICS SOLVES RoHS-RELATED SOLDERING PROBLEMS

FRENCHTOWN, N.J., Aries Electronics, now offers a new ball grid array (BGA) to BGA adapter which resolves soldering issues that arise when BGA devices with RoHS-compliant solder balls are assembled with other devices whose connections are not lead-free.

Aries' new adapter solves solder joint reliability problems that occur when the lower reflow temperatures used for standard tin-lead eutectic solder balls cause the incomplete reflow of the lead-free solder balls. The lower temperatures may also be required to avoid damaging the PCB and other components on the board.

Because the body for the BGA-to-BGA adapter is made from RoHS-compliant, high-temperature (IPC 4101A 24/26/28) glass reinforced material, lead-free components can be mounted to the new adapter using the necessary higher temperatures. Then, since the adapter is terminated with eutectic tin-lead balls that have standard reflow temperatures profiles, the assembly is mounted to the tin-lead PCB using standard temperatures; thus resolving solder mismatch concerns. The adapter's finish is three to eight microinches of gold over nickel (ENIG) with a red solder mask.

As with all Aries adapters, the new adapter is available in custom materials, plating, sizes and configurations to suit specific customer applications.

Pricing for the BGA-to-BGA adapter ranges from $5 to $15 each, depending on the ball count and the quantity required. Lead time is three to four weeks.
FRENCHTOWN, N.J., October 2006 -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has introduced a new CSP test socket for devices from 28 mm2 to 40 mm2. The new socket is ideal for manual testing of devices with pitches down to 0.40 mm, such as CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and Flash devices.

NEW 12-BALL MICROBGA TO 14-PIN DIP
ADAPTER NOW AVAILABLE FROM ARIES

Frenchtown, NJ, -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has announced a new adapter that enables designers to test or bread board a 12-ball microBGA device on an existing PCB with 0.300” holes. The top of the adapter accepts a 12-ball microBGA on 0.5 mm pitch; the bottom of the adapter features 14 DIP pins.

The UL 94V-0-rated adapter body is constructed of a 0.062” thick glass-filled FR-406 material with one ounce copper traces and ENIG (electroless nickel immersion gold) plating. Male pins are brass alloy 360 with 200 µ” tin/lead over 100 µ” nickel per
QQ-N-290.

The new Aries adapter is part of the company's unique Correct-A-ChipTM line of intelligent connectors that can modify existing designs without changing existing PCB layouts. The adapter can be furnished in custom materials, platings, sizes and configurations to meet specific application needs.
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Pricing for a standard 14-307799-11 adapter is $9.56 each in quantities up to 300. Volume prices are also available. Delivery is stock to three weeks ARO.
The new socket provides minimal signal loss for higher bandwidth capability via a signal path of only .077” (1.95 mm). The socket’s overall size of 3.050” (77.47 mm) x 2.500” (63.50 mm) x 1.271” (32.28 mm) provides the maximum allowable space for board components and connectors.

NEW CORRECT-A-CHIP ADAPTERS FROM ARIES ALLOW SOIC INTERCHANGE

Frenchtown, NJ, -- Aries Electronics, Inc., an international manufacturer of standard, programmed and custom interconnection products, has introduced two new Correct-A-Chip™ adapters that permit the use of SOIC (small outline integrated circuit) D package 150 mil body chips to be used on boards designed for SOIC DW package 300 mil body chips and vice-versa.The new series 666000 adapters accept narrow-body SOIC D package devices while mounting on boards designed for wide-body SOIC DW package footprints. Series 665000 adapters accept wide-body SOIC DW package devices while mounting on boards designed for narrow-body SOIC D package footprints. Both designs are available in pin counts from eight through 24 pins, and are constructed of .062 inch (1.56 mm) FR-4 boards manufactured to IPC-600E Class 2 standards. The FR-4 material is glass filled and UL94V-0 rated, with one ounce of copper traces. The male pins are brass with 200µ" tin over nickel plating. All Aries Correct-A-Chip™ adapters are manufactured and inspected using IPC-610B Class 2 guidelines and are available in custom materials, platings, sizes and configurations to suit specific customer applications.Solderless, pressure-mount compression spring probes allow the socket to be easily mounted to and removed from the test board. These gold-over-nickel compression spring probe screws leave very small witness marks on the bottom of the device solder balls, and are accurately located by two molded plastic alignment pins and secured with four stainless steel screws.

NEW CSP TEST AND BURN-IN SOCKET FROM ARIES ACCOMMODATES DEVICES FROM 41 MM2 TO 55 MM2

Frenchtown, NJ, June 2005– Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has introduced a test and burn-in socket that accommodates device packages from 41 mm2 up to 55 mm2 in applications up to 1 GHz. The new size, which features a standard molded socket format, is ideal for the test and burn-in of IC devices such as SRAM, DRAM, DSP and Flash, as well as packages including CSP, MicroBGA, LCC, LGA, QFP, QFN and MLF. The socket can accommodate lead pitches from 0.45 mm to 2.54 mm. A spring-loaded, cam-actuated pressure pad applies force against the device after the socket lid has been closed and latched and the cam is in position. Reversing the cam removes the force prior to unlatching the spring-loaded lid. The socket features easy mounting and removal from the burn-in board (BIB) via solderless pressure-mount compression spring probes accurately located by two molded plastic alignment pins and secured with four stainless steel screws. The signal path of the new socket during test is only 1.92 mm (.077"). At pitches above 0.80 mm using a large probe, 1 dB of bandwidth at 1 GHz can be achieved. Operating temperature of the socket ranges from -55°C to +150°C (-67°F to +302°F), and estimated contact life is 500,000 cycles. The socket’s molded components are UL94V-0 PEEK and/or Ultem. Compression spring probes are heat-treated beryllium copper alloy, plated with 30 µ" min. (.75 µm) gold per Mil-G-45204 over 50 µ" min. (1.25 µm) nickel per QQ-N-290. This gold over nickel plating on the probes leaves very small witness marks on the bottom surface of the solder balls. The insertion force of spring probe contacts is 9 g to 12 g per contact for 0.50 mm to 0.75 mm pitches, and 17 g to 20 g per contact for 0.80 mm pitches and larger. All hardware is stainless steel.As with all Aries sockets, the new burn-in and test socket is available in custom materials, platings, sizes and configurations to suit specific customer applicationsARI-A-7212

ARIES ANNOUNCES NEW 160-PIN QFP CORRECT-A-CHIP ADAPTER

Frenchtown, NJ, May 2005 -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has announced the development of a new Correct-A-Chip adapter that converts a 160-pin QFP package with .65 mm pin-to-pin spacing into a 160-pin through-hole array. With this adapter, the QFP package can be used in boards designed for the through-hole footprint of a Yamaichi footprint socket, resulting in a more reliable connection than with a QFP socket. The UL94V-0 rated adapter is constructed with a .062" thick, glass filled FR-4 material with 1 oz. copper traces. The male pins are brass alloy 360 per ASTM-B-16 plated with 200 u" tin over 100 u" nickel per QQ-N-290, and are both soldered and pressed into the body, providing a rugged and reliable solder connection. The extremely low profile of the adapter provides extra room for mounting the component in space-restricted applications.

This adapter is part of Aries’ line of Correct-A-Chip intelligent connectors, which can modify and upgrade existing designs without changing existing PCB layoutsThe 4-point spring probe crown on the new socket ensures “scrub” on solder ball oxides for reliable contact mating, and the pointed probe works with LGAs, MLFs and other device types.

ARIES UNVEILS 1,400-PLUS BALL HIGH DENSITY PINBALL SOCKET WITH HEATSINK FOR HIGH-END GRAPHICS PROCESSORS

Frenchtown, NJ, March 2005 – Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has introduced a high pin count (over 1,400 balls) version of its unique PinBall Socket, featuring a customized heatsink, designed for high-end graphics processors.The new PinBall Socket can be soldered directly to the existing footprint of a PC board, further increasing packaging density. An aluminum heatsink provides effective thermal dissipation of excess heat generated by the high performance graphics processors for which the socket is designed. The versatile BGA/LGA socket provides 2 mm of clearance for end components, and can be used for 0.80 mm, 1.00 mm and 1.27 mm pitch packages up to 50 mm, in any footprint configuration and on any size board.

The new socket incorporates Aries’ high reliability spring probe technology, with a spring force of 17 grams at .025" deflection. The spring is BeCu alloy, and the pins are

gold-plated brass alloy. The socket insulator is Torlon or PEEK with stainless steel hardware. The socket can be furnished with either a 2-bolt (for 15 mm packages and smaller) or 4-bolt (for 16-50 mm packages) hold-down.The compression spring probes are heat-treated beryllium copper alloy, plated with

NEW 44-PIN TEST PLUG FROM ARIES FOR USE WITH STANDARD PLCC SOCKETS - A new test plug for use with standard PLCC sockets. The new 44-pin plug can either have a cable soldered directly to the plug, or a socket or header on the topside of the new plug, giving the customer three choices of connections for maximum flexibility. The rugged test plug can withstand multiple insertions and extractions. It can also be used to debug and test circuit board prototypes as well as interface additional circuitry to an existing design. The 44-301695-XX test plug’s body is constructed of a .062" thick, FR-4 material with 1 oz. of copper traces, and is UL94V-0 rated. Male pins are brass alloy 360 with 200” tin over 100” in nickel per QQ-N-290. The socket version pins are phosphor bronze alloy per QQ-B-750. The new test plug is part of Aries’ extensive Correct-A-Chip™ "intelligent connectors" that can modify existing designs without changing existing PCB layouts. These adapters can also incorporate both passive and active components. The test plug is available in custom materials, platings, sizes and configurations to suit specific customer requirements.30 µ” min. (0.75 µm) gold per Mil-G-45204 over 30 µ” min. (0.75 µm) nickel per QQ-N-290. The socket’s molded components are UL94V-0 PEEK and/or Ultem. All hardware is stainless steel.

ARIES NOW OFFERS NEW SOIC ADAPTER FOR COST-EFFECTIVE UPGRADES FROM OLDER RELAYS SOIC adapters that quickly and cost effectively provide an upgrade from older Aromat HB2E relays to surface mount TXSS relays while keeping the same PBC layout.Available on .300" (7.62 mm) DIP centers, the new adapter can be mounted on PCBs with a PCB hole diameter of .028" +/-.003" (.71 mm +/-.08 mm). The adapters are available with 8 leads.The adapters are constructed of .062" (1.57 mm) thick FR-4 with 1 oz. of copper traces on both sides. The pins are 360 * hard brass alloy, per UNS C36000 ASTM-B16085, and pin plating is 200µ (5.08µm) minimum tin/lead 93/7, per MIL-P-81728 over 100µ (2.54µm) minimum nickel, per QQ-N-290. Operating temperature is 221°F (105°C). Pricing for 1000 pieces is $5.40 each with delivery from stock to three weeks. Data sheet #18086 Rev. C Contact forces of the new sockets are 16g per contact for 0.40mm pitch and 25g per contact for 0.50mm pitches and larger. Operating temperature is -55°C to +150°C (-67°F to +302°F). Estimated contact life is over 500,000 cycles.

NEW ARIES ADAPTER ENABLES REPLACEMENT OF PLCCCOMPONENTS TO SOJ AND SOIC DEVICES WITHOUT CHANGINGPBC LAYOUT A new line of adapters thatenable designers to upgrade existing PLCC devices to SOJ orSOIC without the need for a new PBC layout. The pins of the newadapters, which butt solder to the PLCC pads, are available in .09"or .03" length versions. The adapters are ideal for use on legacychips, such as a Motorola MC145158-2 integrated circuit.The board material of the new surface mountable adapter is .062" (1.57 mm) thick FR-4 with 1 oz. of coppertraces on both sides. The adapter’s pins are 360 * hard brass alloy, per UNS C36000 ASTM-B-16-85, andpin plating is 200µ (5.08µm) minimum tin, per MIL-T-10727 Type 1 or tin/lead 90/10 MIL-P-81728 over 100µ(2.54µm) nickel per QQ-N-290. Operating temperature is 221°F (105°C). The adapters are available with 20to 84 leads.Pricing for 500 pieces of a 20 -lead adapter is $6.92. Delivery is stock to 3 weeks ARO.Data sheet #18079 Rev. BPricing for a 100-pin socket starts at $170.00. Delivery is four to six weeks ARO.

ARIES INTRODUCES NEW CSP/MICROBGA SOCKET FOR TEST AND BURN-IN OF 14 TO 27 mm2DEVICES IN APPLICATIONS UNDER 1 GHz – A new CSP/MicroBGA test and burn-in socket for devices from 14 to 27 mm2, in applications under 1 GHz. The new pressure-mounted socket requires no soldering and is ideal for test and burn-in of CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and Flash devices with a pitch of 0.50 mm and larger.Aries’ new test and burn-in socket incorporates spring probe contacts that offer maximum ease of use and flexibility. The spring probe contactInterposer set can be easily replaced on-site, and Interposer sets with different footprints for devices with the same overall package size can be used with the new socket. The socket also features integral plastic alignment posts that accurately line up the spring probe interposer set and socket to the PCB for secure mounting, and a 4-point crown to ensure "scrub" on the solder oxides.The small overall size of the socket allows for the maximum number of sockets per burn-in board (BIB), and BIBs per oven, while providing easy access for fast device insertion and removal.The signal path during test is only 0.077" (1.92 mm) and operating temperature is -55°C to 150°C (-67°F to 302°F). Based on a device with a 0.50 mm pitch, pin inductance of the new socket is 0.75 nH Max.; mutual inductance is less than 0.15 nH; and mutual capacitance is 0.03 pF max.Compression spring probes are heat treated beryllium copper alloy with 30µ" min (0.75µm) gold per Mil-G-45204, over 30µ" min. (0.75µm) nickel per QQ-N-290. Contact force is 9g to 12g per contact for devices with pitches from 0.50 mm to 0.75 mm, and 17g to 20 g per contact for devices with an 0.80 mm pitch or larger. Estimated contact life is 500,000 cycles. Molded socket components are UL94V-0 Carbon-filled PEEK or glass-filled Ultem,with a Teflon coated backing plate. All hardware is stainless steel.As with all Aries sockets, the new CSP/MicroBGA socket is available in custom materials, platings, sizes and configurations to suit specific customer applications.Pricing starts at $130 each for a 100-ball package in burn-in quantities. Delivery is 2 weeks ARO. Data sheet #23018

A BGA/CSP test and burn-in socket for devices with a pitch from 0.50 mm or larger in applications of up to 1
GHz. The new socket features a standard molded socket format that can accommodate any device package up to 13
mm2. It is ideal for test and burn-in of CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and Flash devices.
The socket incorporates solderless pressure-mount compression spring probes accurately located by two molded plastic alignment pins and secured with four stainless steel screws, making for easy mounting to and removal from the burn-in board (BIB). The pressure pad compression spring provides proper force against the device and allows for height variations in device thickness. The socket’s small overall size allows the maximum number of sockets per BIB, and BIBs per oven, while allowing easy access for fast device insertion and removal.
The socket can accommodate up to 500,000 cycles. Spring probe contacts are 9 g to 12 g per contact for 0.50 mm to 0.75 mm pitches, and 17 g to 20 g per contact for 0.80 mm pitches and larger. Operating temperature of the socket ranges from -55°C to 150°C (-67°F to 302°F). The socket’s molded components are UL94V-0 Ultem and machined components are UL94V-0 PEEK. Spring probes are heat-treated beryllium copper alloy, plated with 30 µ" min. (.75 µm) gold per Mil-G-45204 over 30 µ" min. (.75 µm) nickel per QQ-N-290. All hardware is stainless
steel.
As with all Aries sockets, the new burn-in and test socket is available in custom materials, platings, sizes and configurations to suit specific customer
applications.

ARIES REVOLUTIONARY, COST-EFFECTIVE SIDE-STACKABLE BGA LGA SOCKET
The first side-stackable BGA socket available on the market.The Pin-Ball Socket, can be soldered side-by-side, directly to the existing footprint of a PC board, dramatically improving packaging density.The surface mount BGA and LGA socket provides 2 mm of clearance for end components and can be used for 1.00 mm and 1.27 mm pitch packages up to 50 mm in any footprint and on any size board.The Pin-Ball Socket incorporates Aries’ reliable spring probe technology, with a spring force of 17 grams at .025" deflection.The new socket employs an Ultem insulator with stainless steel hardware.The spring is BeCu alloy and the pins are gold-plated brass alloy. Users have the choice of a metal cover or customized aluminum heatsink.
The socket is available in 2-bolt (15mm package or smaller) or 4-bolt (16—50mm package) hold-down styles, depending upon the device size required.

Pricing for the Pin-Ball Socket starts at $1.00 per ball in quantities of 5 sockets. Delivery is 2 weeks ARO.

NEW 1.00mm AND 1.27mm PITCH BGA SOCKETS AND ADAPTERS NOW AVAILABLE FROM ARIES Frenchtown, NJ,

Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, now offers BGA sockets and adapters with pitches of 1.00 mm or 1.27 mm.The new BGA adapter features three polarizing locating pins ensuring perfect alignment of the adapter with the socket. The BGA socket has 3-finger female contacts that provide wiping action. The socket features stamped and formed contact pins, unlike the more costly machine pin design currently used in the industry. When mated together, the BGA socket and BGA adapter measure only 3.17 mm (.125") in height.The extremely low insertion and withdrawal forces, provided by a gold-plated mating contact system, make the socket and adapter ideal for high I/O or ball count applications. This contact system can also eliminate the need for a ZIF socket.Operating temperature for socket and adapter is 125°C (257°F) with a current rating of 1 amp. The base of each device is UL94V-0 FR-4 and estimated durability is 100 mated cycles.

Aries also offers specialized design and production of the BGA socket and adapter, including custom platings, sizes, configurations and materials, depending on quantities.The first side-stackable BGA socket available on the market. The first side-stackable BGA socket available on the market.

ARIES INTRODUCES 1.0 mm PITCH BGA/CSP HYBRID SOCKET

Aries Electronic, has introduced a hybrid socket featuring a unique spring-type contact for use in both ball grid array (BGA) and chip scale packaging (CSP) applications. The new sockets are currently offered with pitches of 1.0 mm and above, and can be furnished with pitches down to 0.5 mm for CSP applications.Bolting the socket base down to the target board makes spring contact with that board. When the socket cover is attached to the base, the balls of the BGA device mate with the spring contacts.The socket employs four threaded inserts for bolting the cover to the socket base (the cover-attach screws are provided with the socket). The socket housing also contains two locating pins to align the socket contacts precisely to the target board pads.Each socket is matched to the BGA device to ensure a perfect fit. The socket base, contact housing (interposer) and cover are made of unfilled PEEK.

The contact springs are BeCu C17200 plated with 30µ of gold over nickel.The Pin-Ball Socket, can be soldered side-by-side, directly to the existing footprint of a PC board, dramatically improving packaging density. The Pin-Ball Socket, can be soldered side-by-side, directly to the existing footprint of a PC board, dramatically improving packaging density.

ARIES INTRODUCES NEW DIP-TO-.100" FLEXIBLE JUMPERS

Aries Electronics Inc. has introduced a new line of flexible jumper assemblies
featuring popular DIP configurations on one end and .100" spacing conductor pins on the other. The new Deci-CenterTM jumpers are offered in DIP configurations of .300" center spacing with 4 through 20 pins; .400" spacing with 22 pins; and .600" centers with 24, 28 or 40 pins. The jumpers feature reliable, electrically tested solder connectors. Cable on the DIP end is potted to provide strain relief.Protective covers are furnished on the header.The new jumpers also feature pitch bars to maintain a precise .100" (2.54mm) conductor spacing, and 10-color cable for easy conductor identification and signal tracing.Materials for the jumpers include: UL 94-HB glass filled nylon header body and pitch bar; gold over nickelplated * hard brass pins; and UL Style 2697 PVC cable insulation.Key specifications include: cable current rating of 1 Amp @ 10°C above ambient;300 Volts; and cable temperature rating of 176°F (80°C).The new Deci-Center jumper assemblies can be furnished in lengths to meet virtually any customer requirement.

Pricing for a 14-pin, 12 inch long Deci-Center is $13.95 each in quantities of 100. Delivery is 4-6 weeks ARO.

Aries Introduces New BGA Test Socket for Mobile Pentium® 111

Aries Electronics, a leader in standard and custom interconnection and packaging technology, has introduced a new test socket designed for the BGA version of the Intel® Mobile Pentium® III processor.

The new Aries 495-lead BallNest™socket is designed to be surface-mounted directly onto PCB pads of the customer’s motherboard. The test socket features beryllium-copper contacts plated with 200µ" 90/10 tin/lead over nickel, and terminated in 90/10 lead/tin solderballs on the bottom side of the socket. The insulator, lid, and base are fabricated from UL94V-0-rated FR-4 material.The Pin-Ball Socket incorporates Aries’ reliable spring probe technology, with a spring force of 17 grams at .025" deflection. The Pin-Ball Socket incorporates Aries’ reliable spring probe technology, with a spring force of 17 grams at .025" deflection.

ARIES EXPANDS PGA ZIF TEST SOCKET LINE

The new socket employs an Ultem insulator with stainless steel hardware.The new socket employs an Ultem insulator with stainless steel hardware.

ARIES ELECTRONICS EXPANDS LINE OF DISPLAY SOCKETSThe spring is BeCu alloy and the pins are gold-plated brass alloy. The spring is BeCu alloy and the pins are gold-plated brass alloy.

Smallest 64-pin .5mm TQFP to .8mm QFP Conversions Now Possible with New Aries Correct-A-Chip™ Pitch switch AdaptersUsers have the choice of a metal cover or customized aluminum heatsink. Users have the choice of a metal cover or customized aluminum heatsink.

Aries Introduces New SSOP-TO-SOWIC Correct-A-Chip™ AdaptersThe socket is available in 2-bolt (15mm package or smaller) or 4-bolt (16—50mm package) hold-down styles, depending upon the device size required. The socket is available in 2-bolt (15mm package or smaller) or 4-bolt (16—50mm package) hold-down styles, depending upon the device size required.