| ARIES ELECTRONICS / LARSEN ASSOCIATES |
 Standard and Custom BGA / LGA / CSP Chip Scale Packaging Information |
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Chip Scale Test Sockets Test & Burn-In of BGA, MicroBGA, LGA, DSP, QFN, QFP, SRAM, DRAM, LCC, MLF, Flash Devices, & More
For Any SMT device, .3 mm pitch & up.
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Aries CSP/BallNest™ Hybrid Sockets
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© Copyright 1988-2010 Larsen Associates /
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| 5/4/09 |
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